Intel skal producere chips for ny PLD-pioner
Tabula - der står bag en banebrydende 'tre-dimensionel' programmerbar chipteknologi kaldet 3PLD - indgår bemærkelsesværdig foundry-partnerskab med Intel (english).
Tabula Inc. have confirmed previous speculation that it is implementing a family of 3PLD products manufactured by Intel using its advanced 22nm manufacturing process featuring 3-D Tri-Gate transistors and co-optimized packaging technology.
This is made possible by a manufacturing access agreement between Tabula Inc., and Intel Custom Foundry, a division of the Technology and Manufacturing Group of Intel Corporation.
The 3PLD family will be based on Tabula’s 3D Spacetime architecture and will deliver high-performance, cost-effective solutions for network infrastructure systems requiring high-bandwidth data flows such as Switches, Routers, Packet Inspection appliances, and other high-performance systems. The combination of process and architecture will allow Tabula to produce high-performance programmable circuits that consume significantly less chip area than circuits implemented with traditional FPGA fabrics.
- Intel’s revolutionary manufacturing technology breakthrough employing 3-D Tri-Gate transistors at the 22nm process node will provide our company with a head start of several years, much as Intel achieved in 2007 by introducing high-k metal-gate (HKMG) transistors at the 45nm node, says Daniel Gitlin, Tabula’s Vice President of Manufacturing Technology.
- We believe this breakthrough will extend Tabula’s Spacetime technology lead further beyond the rest of the programmable logic industry.
Reducing interconnect by building 3D PLDs
In traditional FPGA fabrics, interconnect is the biggest challenge since the complex circuits designers want to implement demand minimal internal delays and higher and higher operating frequencies.
As FPGAs have become larger, and with the advent of 100 Gigabit Ethernet requirements, the traditional FPGAs are reaching their performance limits and bottlenecks are appearing when data moves between memory and I/O ports, and in DSP and logic functions.
Eliminating these limitations, Tabula’s novel Spacetime programmable fabric delivers a balanced architecture with dramatically shorter interconnects than traditional FPGAs and the ability to clock the entire fabric – logic, DSP, memory, and interconnect - at the same frequency. To do that, the Spacetime architecture uses time as a third dimension to reduce the number of components needed to implement a function and can thus deliver smaller, higher performance, more cost-effective chips that are well suited for a wide range of applications, spanning telecommunications, enterprise networking, and wireless infrastructure markets.
- Intel’s 3-D TriGate transistors are a revolutionary breakthrough and provide an unprecedented combination of improved performance and energy efficiency, which Intel and our manufacturing customers like Tabula can use to bring superior computing capabilities to market. Intel has worked closely with Tabula throughout the product design cycle to co-optimize Tabula’s 3PLD family with Intel’s 22nm manufacturing process and design kits, says Sunit Rikhi, vice president, Technology and Manufacturing Group, Intel.
By leveraging Intel’s 22nm process and functional enhancements to the Spacetime architecture introduced in its ABAX family, Tabula’s 22nm products will be able to meet the needs of even more complex and higher performance systems.
- Tabula’s mission is to deliver the benefits of programmable logic beyond the limits of FPGAs and into the much larger $110B custom logic market, says Dennis Segers, Tabula’s Chief Executive Officer.
- This manufacturing agreement lets Tabula deliver to our customers world class process technology, coupled with large-scale manufacturing, and an advanced programmable logic fabric – all critical in our quest to grow as an independent programmable logic leader.
www.tabula.com/products
Read more about Tabula and the technology in Elektronik & Data:
http://www.e-pages.dk/odsgard/120/
http://www.e-pages.dk/odsgard/185/
Relaterede nyheder
- • Referencedesign beskytter FPGA IP
- • Altera demonstrerer optisk FPGA-teknologi
- • Lattice understøtter MIPI BIF standard
- • Xilinx gør det lettere at designe med de nye FPGAer i 7-serien
- • Tre nye applikations-optimerede LatticeECP3 FPGA'er
- • Lattice køber SiliconBlue Technologies
- • Processorplatform med integreret FPGA er nu i produktion
- • Altera kan nu levere 28nm Arria V FPGA'er
- • Lattice lancerer ny FPGA-familie
- • FPGA-board til OpenRISC SoC designs
- • FPGA-modul til realtime Ethernet
- • Synopsys forbedrer FPGA-baserede prototypeværktøjer
- • FPGA'er i verdens mest kraftfulde konfigurerbare computer
- • Altera med ny Quartus II 11.1 software
- • Prevas bliver Xilinx træningspartner
Seneste nyheder
- • Touch platform emulerer fysiske trykknapper
- • IAR Systems etablerer danske salgsorganisation
- • AMD udvider APU platformen med ny R-serie
- • Ericsson klar med ny generation af powermoduler
- • Første 4 Gbit LPDDR'er i 20nm teknologi
- • SemiSouth sampler første 650V SiC JFETs
- • Digi-Key i globalt samarbejde med t-Global Technology
- • austriamicrosystems bliver til 'ams'
- • Find spændende apps til OrCAD og Allegro på nettet
- • Future lancerer energy harvesting testplatform
- • HDMI bridge-IC strømliner HD-konnektiviteten
- • Box med display
- • Ny standard for trådløs opladning i støbeskeen
- • Stor opbakning til nye M2M standard i 'white space' området
- • AMD Embedded G-Series undestøtter Windows RTOS
- • Ny 600V IGBT platform
- • COM-modul med næste generation Atom dual-core processorer
- • Danfoss afhænder datterselskab
- • Renesas hos RS
- • Würth Elektronik på vej med transformerkomponenter til trådløs opladning
- • Segger Microcontroller hos Farnell
- • I/Q demulator med ultrabred båndbredde
- • Nyt kompakt COM modul fra VIA
- • Low-cost fugtigheds- og temperatursensor
- • Brüel & Kjær og Agilent samarbejder om 'voice-over-LTE' testsystemer