
ITT lancerer konnektorløsning til de nye CFast memorykort
ITT er klar med interkonnekteringsløsning, der sigter mod CFast, der en den seneste standard for flash-baserede memorykort (in english).
Leading global connector manufacturer and supplier ITT Interconnect Solutions has announced the launch of a new line of ultrasonically welded two-piece cover sets and 24-pin surface mount connectors designed to meet the latest CFast standards issued by the Compact Flash Association.
Developed to accommodate consumer demand for faster storage speeds in such applications as digital cameras, handheld portable devices, computers and medical instruments, this latest CFast standard is the combination of Compact Flash (CF) and ATA Serial Transport (AST) which offers both flexibility and speed.
ITT ICS developed its new CFast card kits and connectors to provide both the parallel (PATA) and serial (SATA) interfaces demanded by the new CFA standard and conform to both Type I and Type II of the new specifications. The CFast cover sets consist of a plastic frame moulded around a stainless steel cover and oriented in position with guide-posts, which simplifies assembly. Once assembled, the covers are ultrasonically welded together with a continuous weld joint around the perimeter of the card and are the most secure, tamper-proof, rigid and robust card kits available on the market today.
ITT ICS CFast card kits can be customised to meet any CFast product application. Further product features include optional mylar insulation which can be customised to suit any specification. The 24 position host and module surface-mountable connectors are available in a variety of off-sets and can be mated up to 10,000 cycles. CFast card kits are available in either Type I or Type II packages and are RoHS compliant. ITT ICS also offers a complete line of USW assembly tools to support the new product.
Additional applications include digital video equipment, security devices, set-top boxes and industrial/enterprise storage systems.
www.ittcannon.com
Relaterede nyheder
- • Interkonnekteringsystem understøtter 28 Gbit/s datatransmission
- • Kompakt stik med push-in tilslutning
- • Kompakte switches til Ethernet/IP
- • Unikke magnetiske switch sensorer hos Mouser
- • Keramisk chipkondensator er tæt på usynlig
- • Laird sætter fokus på brug af RF chipinduktorer
- • Nye throw-switche fra Skyworks
- • Molex satser på medicoapplikationer
- • Tact switche klarer en million cycles
- • Tyndfilms teknologi baner vej for ultrakompakte båndpass filtre
- • Micro-miniature slide switch
- • Keramiske kondensatorer til krævende applikationer
- • Trykknapper med fuld knald på farverne
- • PEI-Genesis i samarbejde md Deutsch Aerospace
- • Kondensatorer kan tunes digitalt
Seneste nyheder
- • Touch platform emulerer fysiske trykknapper
- • IAR Systems etablerer danske salgsorganisation
- • AMD udvider APU platformen med ny R-serie
- • Ericsson klar med ny generation af powermoduler
- • Første 4 Gbit LPDDR'er i 20nm teknologi
- • SemiSouth sampler første 650V SiC JFETs
- • Digi-Key i globalt samarbejde med t-Global Technology
- • austriamicrosystems bliver til 'ams'
- • Find spændende apps til OrCAD og Allegro på nettet
- • Future lancerer energy harvesting testplatform
- • HDMI bridge-IC strømliner HD-konnektiviteten
- • Box med display
- • Ny standard for trådløs opladning i støbeskeen
- • Stor opbakning til nye M2M standard i 'white space' området
- • AMD Embedded G-Series undestøtter Windows RTOS
- • Ny 600V IGBT platform
- • COM-modul med næste generation Atom dual-core processorer
- • Danfoss afhænder datterselskab
- • Renesas hos RS
- • Würth Elektronik på vej med transformerkomponenter til trådløs opladning
- • Segger Microcontroller hos Farnell
- • I/Q demulator med ultrabred båndbredde
- • Nyt kompakt COM modul fra VIA
- • Low-cost fugtigheds- og temperatursensor
- • Brüel & Kjær og Agilent samarbejder om 'voice-over-LTE' testsystemer