
LIN transceivere sigter mod europæiske applikationer
Melexis lancerer ny generation af LIN transceiver, der sigter mod de stadig flere europæiske virksomheder, som satser på LIN bussen (in english).
The LIN bus continues its successful adoption in automotive applications. This robust, cost effective communication scheme enables many basic networking functions in sub-systems previously considered to be uneconomical for smart sensors, actuators and controls.
As a consequence of this successful implementation of many different LIN applications there is a need for LIN transceivers to manage the physical connection of the standard MCU to the LIN bus. Melexis new MLX80020BA easily meets the demand for LIN transceivers compliant to the LIN 2.x standard.
The MLX80020BA is a standalone LIN transceiver with outstanding performance. Designed and fabricated in 0.35 micron HV-CMOS technology enables lower system costs for our customers LIN implementations. This transceiver has built in safety functions including TxD dominant time out as well as high impedance bus pin in case of loss of ground and under-voltage condition. The pin configuration of this new LIN transceiver is compatible to the defined standard pin out of the OEMs.
The EMC behavior of LIN Bus ICs is critical in automotive applications. The MLX80020BA design exhibits remarkable robustness when subjected to the injection of high frequency disturbances. The IC has also achieved very low electromagnetic emission to further simplify the design challenges of networked communication in hostile automotive environments. The timing parameters are optimized for the data transmission according LIN 2.x to obtain excellent EMC behavior.
The MLX80020BA meets the automotive temperature range of -40°C to 125°C and has on chip protection against over-temperature, 40V load dump and LIN short to ground resulting in a lower system component count and cost. The integrated standby management assures that the MLX80020BA can “wake up” from the LIN bus itself or directly from a connected microcontroller or an additional external source. Typical current consumption in sleep mode is lower than 9µA.
PPAP samples are available and come in a cost efficient SOIC8 RoHS compliant package. Technical specifications are available at:
http://www.melexis.com/In-Vehicle-Networking/General/MLX80020BA-772.aspx
Relaterede nyheder
- • I/Q demulator med ultrabred båndbredde
- • Opkoblere med lavt effektforbrug
- • Piezoelektriske MEMS oscillatorer med ultralav jitter
- • High-voltage charge pump med lav ripple
- • A/D konvertermodul med integreret signalkonditionering
- • SAR A/D konverter med ekstrem 99,8dB SNR
- • Nye familie af mux og switche
- • Motor-drivere til batteridrevet udstyr
- • RS232/RS485 multiprotokol transceiver med integreret terminering
- • Komplette analoge front-ends til ECC/EEG applikationer
- • RS485 og RS232 µModule transceivere med udvidet temperaturområde
- • Downconverting mixer dækker 4-6 GHz området
- • Ny familie af IC'er understøtter Thunderbolt teknologi
- • Innovativ silicium-baseret oscillator-teknologi klar til produktion
- • FTDI lancerer ny generation af USB interface IC'er
Seneste nyheder
- • Touch platform emulerer fysiske trykknapper
- • IAR Systems etablerer danske salgsorganisation
- • AMD udvider APU platformen med ny R-serie
- • Ericsson klar med ny generation af powermoduler
- • Første 4 Gbit LPDDR'er i 20nm teknologi
- • SemiSouth sampler første 650V SiC JFETs
- • Digi-Key i globalt samarbejde med t-Global Technology
- • austriamicrosystems bliver til 'ams'
- • Find spændende apps til OrCAD og Allegro på nettet
- • Future lancerer energy harvesting testplatform
- • HDMI bridge-IC strømliner HD-konnektiviteten
- • Box med display
- • Ny standard for trådløs opladning i støbeskeen
- • Stor opbakning til nye M2M standard i 'white space' området
- • AMD Embedded G-Series undestøtter Windows RTOS
- • Ny 600V IGBT platform
- • COM-modul med næste generation Atom dual-core processorer
- • Danfoss afhænder datterselskab
- • Renesas hos RS
- • Würth Elektronik på vej med transformerkomponenter til trådløs opladning
- • Segger Microcontroller hos Farnell
- • I/Q demulator med ultrabred båndbredde
- • Nyt kompakt COM modul fra VIA
- • Low-cost fugtigheds- og temperatursensor
- • Brüel & Kjær og Agilent samarbejder om 'voice-over-LTE' testsystemer