
Nyt Mini-ITX board fra VIA
VIA lancerer nyt dual-core baseret VB8004 Mini-ITX board.
VIA Announces New Dual Core VIA The VIA VB8004 Mini-ITX board combines the choice of three processors, the 1.6GHz dual core VIA Nano X2 E-Series and, 1.2GHz and 1.6GHz VIA Nano processors, with the VIA VX900 media system processor, providing a high performance and highly scalable solution for advanced digital signage and gaming systems.
The VIA VB8004 Mini-ITX board features a comprehensive array of on-board I/O, including one HDMI port, one DVI port, a one channel 24-bit LVDS, one GigaLAN port, six USB 2.0 ports, and support two SATA hard drives and high-bandwidth DDR3 memory, up to 4GB .
The VIA VX900 MSP features the high performance VIA ChromotionHD 2.0 video processor, offering advanced filtering and cutting edge-processing to perform ultra smooth decoding of MPEG-4/AVC, H.264, MPEG-2, WMV-HD, and AVS video for Blu-ray content, bringing rich 1080p HD video content to life for advanced digital signage and gaming applications.
In addition to providing native support for dual-displays, the VIA VB8004 Mini-ITX mainboard can also be easily upgraded to support four displays using an additional VIA S3 5400E graphics module, providing developers the widest possible variety of multi-display configurations, including HDMI, LVDS, and DVI technologies.
The VB8004-A adds in the VIA S3 5400E dedicated graphics module, a daughter card specially designed to provide advanced multimedia capabilities for next-generation embedded applications and is the best-in-class energy efficient DX10.1 GPU on the market today.
The S3 5400E dedicated graphics module supports DX10.1, Shader Model 4.1, and OpenGL 3.1, and a host of video playback technologies for stunningly smooth HD playback at resolutions of up to 2560 x 1600 pixels. It offers an excellent blend of graphics functionality, performance, power, longevity and stability for reliable, high quality embedded graphics solutions.
Key features:
• Integrated VIA Chrome9 HC DX9 3D/2D graphics with VC1, MPEG-2, WMV9 and H.264 decoding acceleration
• Supports high-bandwidth DDR3 memory, up to 4GB
• Supports two SATA hard drives
• Supports one Gigabit Ethernet
• Supports six USB 2.0 ports
• Supports two COM ports
• Accepts DC power input
• Expansion I/O connector for one 4-lane PCIe, one 1-lane PCIe and one USB
• Supports one DVI-I port, one HDMI port and one single channel 24-bit LVDS panel connector
Texim Europe B.V.
www.texim-europe.dk
nordic@texim-europe.com
Tlf: +45 8820 2632/+45 4042 7826
Relaterede nyheder
- • AMD udvider APU platformen med ny R-serie
- • Box med display
- • COM-modul med næste generation Atom dual-core processorer
- • Nyt kompakt COM modul fra VIA
- • Nye COM Express moduler med Atom E620/E680
- • Udviklingsplatform til motorstyringer
- • Texim i Danmark er ny Aaeon distributør
- • COM Express type 6 moduler med nyeste Intel Core processorer
- • Ny generation af analoge front-ends til energimåling
- • Mouser lagerfører nyt Android udviklingskit
- • Motherboard med AMD Fusion APU'er
- • VIA lancerer første QSeven modul
- • Industriel touchdisplay med optisk bonding-teknologi
- • Ny funktioner til den Arduino-inspirerede Vinco platform
- • Pico-ITX motherboard med dual-core ARM Cortex A9 processor
Seneste nyheder
- • Silicon Labs køber 2,4 GHz specialisten Ember
- • Touch platform emulerer fysiske trykknapper
- • AMD udvider APU platformen med ny R-serie
- • Ericsson klar med ny generation af powermoduler
- • Første 4 Gbit LPDDR'er i 20nm teknologi
- • SemiSouth sampler første 650V SiC JFETs
- • Digi-Key i globalt samarbejde med t-Global Technology
- • austriamicrosystems bliver til 'ams'
- • Find spændende apps til OrCAD og Allegro på nettet
- • Future lancerer energy harvesting testplatform
- • HDMI bridge-IC strømliner HD-konnektiviteten
- • Box med display
- • Ny standard for trådløs opladning i støbeskeen
- • Stor opbakning til nye M2M standard i 'white space' området
- • AMD Embedded G-Series undestøtter Windows RTOS
- • Ny 600V IGBT platform
- • COM-modul med næste generation Atom dual-core processorer
- • Danfoss afhænder datterselskab
- • Renesas hos RS
- • Würth Elektronik på vej med transformerkomponenter til trådløs opladning
- • Segger Microcontroller hos Farnell
- • I/Q demulator med ultrabred båndbredde
- • Nyt kompakt COM modul fra VIA
- • Low-cost fugtigheds- og temperatursensor
- • Brüel & Kjær og Agilent samarbejder om 'voice-over-LTE' testsystemer