
PandaBoard ES åbner nye muligheder
Pandaboard.org introducerer nu PandaBoard ES, der er bygget op omkring Texas Instruments OMAP4460 processor (in english).
Pandaboard.org is an online resource and collaboration site for the growing, active community supporting the so called PandaBoard, a low-cost, open OMAP 4 processor-based mobile software development platform.
Pandaboard.org has just announced the general availability of PandaBoard ES, the next-generation open mobile software development platform based on OMAP 4 technology from Texas Instruments (TI).
PandaBoard ES is the industry’s first board to rely on TI’s OMAP4460 processor. The OMAP4460 processor’s smart multicore architecture includes two ARM Cortex-A9 cores running at up to 1.2 GHz each, and excels at offloading tasks from the CPU and GPU to free them for more intensive applications.
Pandaboard.org also announced that the original PandaBoard is the first and today’s only open source development tool to be supported in the Android Open Source project running Android 4.0 ('Ice Cream Sandwich'), giving developers a jumpstart on related software development.
PandaBoard ES is software compatible with PandaBoard, easing project migration from the original board to the next-generation version. Pandaboard.org will continue to support both boards via its fully-established community of Linux experts. Current and new developers designing on mobile open source software distributions such as Android, Linaro and Ubuntu can register projects and access support information at www.pandaboard.org.
PandaBoard’s next-generation advancements
At the center of PandaBoard ES sits the OMAP4460 processor, delivering a 20 percent increase in overall performance and a 25 percent increase in graphics when compared to the original board’s OMAP4430 processor.
The OMAP4460 processor is complemented by TI’s latest power management technology and dual-channel LPDDR2 memory for faster processing. Also new to PandaBoard ES is the introduction of a SysBoot switch, allowing for the manual switch of boot order depending on the application’s need.
Courtesy of TI’s WiLink 6.0 combo connectivity solution, PandaBoard ES is one of the only open mobile development platforms offering Bluetooth low energy technology hardware support, giving developers the opportunity to craft new applications on this emerging technology.
PandaBoard ES also supports Wi-Fi and Bluetooth technologies. For mobile multimedia developers seeking external display flexibility, the next-generation board offers Display Serial Interface (DSI) support along with the original PandaBoard’s HDMI, Digital Video Interface (DVI) and DPI support.
http://pandaboard.org/content/buy
http://pandaboard.org.
Relaterede nyheder
- • Slagkraftige multicore DSP'er
- • Nye low-power DSP-arkitektur fra CEVA
- • Xilinx tilbyder designværktøj med udvidet DSP-support
- • Low cost DSP og udviklingskit skal åbne nye markeder
- • Texas Instruments vil bekæmpe IP og software pirater
- • Simuleringsmodeller til CEVA's DSP-kerner
- • TI gør det lettere af designe DSP-applikationer
- • Ny biomedicinsk signalprocessor med kolossalt potentiale
- • CEVA udvider familien af DSP-kerner
- • TI introducerer ekstrem slagkraftig DSP
- • Nye værktøjer gør det let at flytte ARM-applikationer til en DSP
- • TI introducerer nye low-power DSP'er
- • CEVA introducerer 1 GHz DSP-kerne
- • ON Semiconductor køber DSP-firma
- • Software toolkit til medicinsk imaging
Seneste nyheder
- • Silicon Labs køber 2,4 GHz specialisten Ember
- • Touch platform emulerer fysiske trykknapper
- • AMD udvider APU platformen med ny R-serie
- • Ericsson klar med ny generation af powermoduler
- • Første 4 Gbit LPDDR'er i 20nm teknologi
- • SemiSouth sampler første 650V SiC JFETs
- • Digi-Key i globalt samarbejde med t-Global Technology
- • austriamicrosystems bliver til 'ams'
- • Find spændende apps til OrCAD og Allegro på nettet
- • Future lancerer energy harvesting testplatform
- • HDMI bridge-IC strømliner HD-konnektiviteten
- • Box med display
- • Ny standard for trådløs opladning i støbeskeen
- • Stor opbakning til nye M2M standard i 'white space' området
- • AMD Embedded G-Series undestøtter Windows RTOS
- • Ny 600V IGBT platform
- • COM-modul med næste generation Atom dual-core processorer
- • Danfoss afhænder datterselskab
- • Renesas hos RS
- • Würth Elektronik på vej med transformerkomponenter til trådløs opladning
- • Segger Microcontroller hos Farnell
- • I/Q demulator med ultrabred båndbredde
- • Nyt kompakt COM modul fra VIA
- • Low-cost fugtigheds- og temperatursensor
- • Brüel & Kjær og Agilent samarbejder om 'voice-over-LTE' testsystemer