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Send til en ven   Udskriv17/1 2012 kl. 10:40
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Qseven modul med AMD processor

Det svenske firma Hectronic introducerer nu et Qseven baseret modul med Fusion G-series APU'er fra AMD (in english)

Hectronic, a specialist in embedded PC development and manufacturing with headquarter in Sweden, has announced H6059, a Qseven module based on the new AMD T40E and T40R ultra low power dual core and single core accelerated processing units (APU) and the A55E embedded chipset.

An APU is a combination of a low-power CPU and an advanced graphics processing unit (GPU) integrated into a single embedded device. H6059 is a Qseven standard revision 1.2 compliant module measuring only 70 mm x 70 mm.
 
The H6059 module is a perfect fit for embedded applications that require powerful CPU and graphics performance in combination with low power consumption and extremely compact size. The Radeon 6250 GPU is integrated with the CPU to offer for instance increased 2D/3D and motion video acceleration performance and can be used for general purpose GPU computing (GPGPU) by taking advantage of AMD’s Open CL support. An on-die GPU such as this has advantages over discrete

GPUs by avoiding the memory bus bottleneck. 
 
H6059 targets applications such as digital signage solutions, high-end HMIs, portable test and measurement applications as well as imaging and vision systems based on for instance high-end cameras.

- The Fusion G-series APUs from AMD on the H6059 Qseven module will provide embedded customers with the possibility to integrate an off-the-shelf solution that has a new and unrivaled level of ultralow power dual core x86 processor performance and advanced GPU capabilities, in a small form factor. It will clearly create opportunities to develop new products that otherwise would have been difficult or even impossible to develop, says Patrik Björklund, Director of Sales and Marketing at Hectronic AB.
 
The features of H6059 includes a rich set of I/O interfaces including for example four PCI Express ports, eight USB 2.0 ports, two SATA ports, LVDS and the new digital display interfaces, DVl, HDMI and DisplayPort, as well as an onboard Intel 82583 Gigabit Ethernet Controller. Legacy I/O is supported through the LPC bus and the module has BIOS support for Super I/O devices on the carrier board.

It’s worth noticing that full legacy ISA bus features such as I/O mapping in memory are supported. This provides industrial customers with an easier migration path including support for their installed product base. SDIO is provided through an onboard USB-to-SDIO controller.
 
The module supports up to 4GB onboard soldered DDRIII DRAM, as well as an onboard soldered BGA SATA Flash SSD of up to 32GB.
 
Hectronic has developed the BIOS for the module based on the new Phoenix SecureCore Tiano UEFI BIOS, and will also provide BSPs for XP Embedded, Windows Embedded Standard 7 and Linux.
 
The verification of H6059 prototypes was initiated in Q4 2011. Early access samples are expected to become available to key OEM customers towards the end of the first quarter of 2012. A version of H6059 optimized and specified for operation in an industrial temperature range is planned for introduction later this year.
 
Technical support is provided directly from Hectronic's development team in Uppsala, near Stockholm, Sweden. Hectronic is a member of the AMD Fusion Partner Program and a participating member of the Qseven Consortium.
www.hectronic.se

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