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Send til en ven   Udskriv9/8 2011 kl. 12:45
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VIA lancerer ny board-formfaktor

VIA introducerer nu det såkaldte Embedded ITX (Em-ITX) board, der kan forsynes med Expansion moduler (in english)

Embedded ITX (Em-ITX) is a compact, versatile and highly integrated embedded board form factor initiated by VIA. The Em-ITX measures in at 17 cm x 12 cm - 30% smaller than Mini-ITX and 30% larger than Nano-ITX.

As a 'midsized' small form factor, it is suitable for a diverse range of embedded systems especially with its unique dual-sided I/O coastline. In addition, Em-ITX has a special Em-IO interface for adding expansion modules for enhancing functionality in vertical applications.


For embedded system developers, flexibility in I/O configurations is necessary in order to meet diverse embedded applications. It is important for them to adopt a standard hardware platform which can substantially reduce development costs, risks, and time.

The Em-ITX form factor enabled developers to design a system with solid performance and comprehensive I/Os using its unique dual-sided IO coastlines. In addition, the Em-IO expansion bus makes the form factor more flexible by enabling systems based on it to easily extend functionality with the use of Em-IO expansion modules.

In case a new or different I/O is needed, or a small production volume is needed, a standard platform based on the Em-ITX form factor can be stacked with an alternate Em-IO expansion module. This can greatly reduce development costs and accelerate the product design cycle.

Because of its small size and dual-sided I/O coastlines, Em-ITX is well suited for ultra compact embedded system products. The dual-sided I/O coastlines enable the reduction of I/O cable clutter - resulting in the possibility of not only a thinner system design but also a more robust system design. Signal integrity is improved significantly because the need for most I/O cables is eliminated.

Em-ITX Features:
- Dimensions: 17 cm x 12 cm
- Self-reliant embedded board that accommodates two full I/O coastlines. The baseboard can contain a series of standard interfaces, such as USB 2.0, Gigabit Ethernet, mouse, keyboard,COM, Compact Flash, IDE, SATA, VGA, LVDS, and etc.
- Scalability in Em-IO interface
- Reliable 160-pin high density and ruggedized Em-IO interface

Modularized Em-IO Interface Expansion

The Em-ITX uses the Em-IO expansion bus. The Em-IO integrates popular bus signals, including: USB 2.0, GPIO, LPC, PCI Express, Display Output signals, ACPI 3.0, and 3.3V/5V/12V DC Power signals. The Em-IO interface connector enables Em-IO expansion modules to be attached to Em-ITX form factor boards and further reduces troublesome cabling issues that are usually encountered when designing systems.

The available EM-ITX program includes:

EITX-3002      1.0-1.6 GHz VIA Nano E CPU, VGA, HDMI, LVDS, 2 GigaLAN, 4 COM, 2 USB3.0, 4 USB2.0                                                                                                          
EITX-3001      1.3 GHz VIA Nano E CPU, VGA, HDMI, LVDS, GigaLAN, 4 COM, 6 USB  resistive touch
EITX-3000      1.0-1.3 GHz VIA Nano E CPU, VGA, 2 LVDS, 2 GigaLAN, 4 COM, 6 USB
EMIO-3110     EmIO S3 Graphics 4300 CPU, 2HDMI, 2DVI, VGA, TV-Out, Audio
EMIO-3210     EmIO 6 COM, 2 parallel
EMIO-3430     EmIO PC Card slot, Optional GPS/Bluetooth/Wireless LAN
EMIO-3450     EmIO 2 Mini-PCIe, SIM slot, Optional GPS/Bluetooth/WWAN/Wireless LAN
EMIO-3451     EmIO 8 COM, 2 USB, MiniPCI Slot, SIM slot, Optional GPS/8 bit Isolated GPI/Wireless LAN
AMOS-5000    Development Chassis Kits


Faster Time to Market

VIA designs and manufactures a series of small form factor embedded boards and expansion I/O modules that support various industrial applications. For Em-ITX, VIA can also provide software support and firmware customization.

The Em-IO module has many of the advantages of a custom design — greatly reducing engineering effort and achieving faster time to market. It can be designed to satisfy applications on networking, multimedia display, POI, POS, etc. VIA provides solid engineering capabilities and longevity support to bring customers’ products to market on

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