
Dataopsamling i 'hede' omgivelser
Texas Instruments lancerer det såkaldte H.E.A.T. evalueringsmodul, der er kvalificeret til at operere ved temperaturer på op til 200ºC (in english).
Texas Instruments (TI) has introduced the H.E.A.T. (harsh environment acquisition terminal) evaluation module (EVM), the industry’s first high-temperature data acquisition system, which includes a complete set of TI signal chain components qualified for extreme temperature operation from -55ºC to 210ºC.
The H.E.A.T. EVM is test-oven ready and qualified to operate up to 200 hours at oven temperatures of up to 200ºC. It accepts eight channels of analog data and conditions, digitizes and processes these signals for a variety of applications in ruggedized, high-temperature environments including downhole drilling, jet engines and heavy industrial applications.
The H.E.A.T. EVM eliminates the need for expensive up-screening and qualification testing of industrial-grade components for temperature ranges outside their datasheet specifications. The tool allows manufacturers to develop applications with components qualified for harsh environments quickly and safely and cuts development, testing and qualification time by up to one year.
Key features and benefits of the H.E.A.T. EVM
• Six channels optimized for temperature, pressure sensors and accelerometers plus two general-purpose channels (fully differential and single-ended).
• Comprehensive set of components qualified for operating temperatures from -55ºC to 210ºC and guaranteed for at least 1,000 hours operating life.
o ADS1278-HT – octal simultaneous sampling 24-bit 128-KSPS ADC
o SM470R1B1M-HT – ARM7 microcontroller
o OPA211-HT – low-noise, precision operational amplifier
o OPA2333-HT – low-power, zero-drift series operational amplifier
o INA333-HT – zero-drift, low-power, single-supply instrumentation amplifier
o THS4521-HT – low-power, fully differential amplifier
o REF5025-HT – 2.5-V precision voltage reference
o SN65HVD233-HT – CAN transceiver
o SN65HVD11-HT – RS-485 transceiver
• Made with polyimide material, and incorporating high-temperature rated passive components and high-temperature solder material, the EVM is test oven ready and can withstand temperatures of up to 200°C for 200 operating hours.
www.ti.com/heat-pr
Relaterede nyheder
- • AMD udvider APU platformen med ny R-serie
- • Box med display
- • COM-modul med næste generation Atom dual-core processorer
- • Nyt kompakt COM modul fra VIA
- • Nye COM Express moduler med Atom E620/E680
- • Udviklingsplatform til motorstyringer
- • Texim i Danmark er ny Aaeon distributør
- • COM Express type 6 moduler med nyeste Intel Core processorer
- • Ny generation af analoge front-ends til energimåling
- • Mouser lagerfører nyt Android udviklingskit
- • Motherboard med AMD Fusion APU'er
- • VIA lancerer første QSeven modul
- • Industriel touchdisplay med optisk bonding-teknologi
- • Ny funktioner til den Arduino-inspirerede Vinco platform
- • Pico-ITX motherboard med dual-core ARM Cortex A9 processor
Seneste nyheder
- • Step-down konverter opererer med 96 procent effektivitet
- • Maxwell Technologies hos Digi-Key
- • Højeffektive DC/DC-konvertere i brick-format
- • Farnell udvider med GNSS/GPS receivere
- • Fuld HD LCD-modul med stor betragningsvinkel
- • Ny teknologi skræmmer fugle væk fra markerne
- • Silicon Labs køber 2,4 GHz specialisten Ember
- • Touch platform emulerer fysiske trykknapper
- • AMD udvider APU platformen med ny R-serie
- • Ericsson klar med ny generation af powermoduler
- • Første 4 Gbit LPDDR'er i 20nm teknologi
- • SemiSouth sampler første 650V SiC JFETs
- • Digi-Key i globalt samarbejde med t-Global Technology
- • austriamicrosystems bliver til 'ams'
- • Find spændende apps til OrCAD og Allegro på nettet
- • Future lancerer energy harvesting testplatform
- • HDMI bridge-IC strømliner HD-konnektiviteten
- • Box med display
- • Ny standard for trådløs opladning i støbeskeen
- • Stor opbakning til nye M2M standard i 'white space' området
- • AMD Embedded G-Series undestøtter Windows RTOS
- • Ny 600V IGBT platform
- • COM-modul med næste generation Atom dual-core processorer
- • Danfoss afhænder datterselskab
- • Renesas hos RS