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Send til en ven   Udskriv7/11 2011 kl. 15:25
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Dual core computing og USB3.0 i 'thin' embedded devices

VIA Embedded lancerer nyt EITX-3002 board og AMOS-5002 industriel chassis (in english).

VIA Embedded brings dual core computing and USB 3.0 to thin embedded devices with its new EITX-3002 board and AMOS-5002 industrial chassis.

The VIA EITX-3002, the latest Em-ITX form factor board, and accompanying VIA AMOS-5002 industrial chassis, the ideal solution for a range of durable and fanless next generation devices in medical, healthcare, industrial and building automation, digital signage, kiosk, POI/POS, gaming and surveillance applications. VIA Embedded offers innovative embedded design for time-to-market solution with this ultra-thin ruggedized fanless embedded platform.

The VIA EITX-3002 board combines the VIA VX900H media system processor with the choice of a 1.2GHz VIA Nano X2 E-Series or 1.0GHz VIA Eden X2 dual core processor offering a full featured I/O specification on a specially developed slim-line board for a wide range of costumer needs.

Main features:
- Em-ITX form factor: 17 cm (W) x 12 cm (L)
- 64-bit dual core processor
- Fanless operation: -10°C to 65°C
- Highly fits for high-end interactive touch screen multimedia applications and supports dual independent display for digital signage
- I/O ports include: 1 VGA, 2 GigaLAN, 1 HDMI, 1 LVDS, 4 COM, 6 USB 2.0, 2 USB 3.0, 1 - CFast socket and built-in DC power
- Supports Windows 7, XP, Debian Linux and Android 2.2

The VIA AMOS-5002 chassis kits are completely fanless and the creative de-thermal design utilizing blade style thermal fins for the dual core processor can withstand a wide temperature range of -20°C to 55°C. Shock-resistant up to 50G and anti-vibration up to 5G, the VIA AMOS-5002 chassis kits are easily assembled and maintained, using only four mechanical pieces to form a robust, fanless system with extensive I/O options.

www.texim-europe.dk
nordic@texim-europe.com
Telefon: +45 8820 2632/+45 4042 7826

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