Kontron får markante ordrer
Kontron har modtaget to store ordrer til en samlet værdi af 41 mio. dollars (in english).
Kontron AG a globally leading provider of embedded computer systems, has announced two design wins totaling $41 million: One of the world's largest measurement technology company's will deploy Kontron technology for its EXT wireless communications test sets.
Over the next five years, the new platform generation for the communication test set project will be based on Kontron's COM Express ETXe-CD modules and Intel Core 2 Duo chipsets. Production is set to start up in the second quarter of 2011 before reaching full output in the first quarter of 2012. The volume for Kontron comprises $24 million.
Kontron is reporting the second design win in the important defense and security/safety market. The order entails a volume of $17 million. Kontron is to provide digital signal processing technology for one of the world's largest manufacturers of defense technology. This project, which is assigned by the US military, is subject to strict confidentiality. The products delivered by Kontron are particularly robust and are planned for aerospace deployment; production is scheduled to commence in the third quarter of 2011.
- For the first time since the important acquisition of the military specialist AP Labs last year, our products will be integrated into AP housings, comments Kontron CEO Ulrich Gehrmann.
- Along with an excellent price/performance relationship, and established and successful customer relationships, our global positioning proved decisive for both design wins. We are the only provider to conduct development and production, as well as to manage customer relationships, across Europe, Asia and North America. For our customers, who are always subject to ever greater time pressure, this results in an unrivalled level of speed with which we can satisfy orders.
Relaterede nyheder
- • AMD udvider APU platformen med ny R-serie
- • Box med display
- • COM-modul med næste generation Atom dual-core processorer
- • Nyt kompakt COM modul fra VIA
- • Nye COM Express moduler med Atom E620/E680
- • Udviklingsplatform til motorstyringer
- • Texim i Danmark er ny Aaeon distributør
- • COM Express type 6 moduler med nyeste Intel Core processorer
- • Ny generation af analoge front-ends til energimåling
- • Mouser lagerfører nyt Android udviklingskit
- • Motherboard med AMD Fusion APU'er
- • VIA lancerer første QSeven modul
- • Industriel touchdisplay med optisk bonding-teknologi
- • Ny funktioner til den Arduino-inspirerede Vinco platform
- • Pico-ITX motherboard med dual-core ARM Cortex A9 processor
Seneste nyheder
- • Step-down konverter opererer med 96 procent effektivitet
- • Maxwell Technologies hos Digi-Key
- • Højeffektive DC/DC-konvertere i brick-format
- • Farnell udvider med GNSS/GPS receivere
- • Fuld HD LCD-modul med stor betragningsvinkel
- • Ny teknologi skræmmer fugle væk fra markerne
- • Silicon Labs køber 2,4 GHz specialisten Ember
- • Touch platform emulerer fysiske trykknapper
- • AMD udvider APU platformen med ny R-serie
- • Ericsson klar med ny generation af powermoduler
- • Første 4 Gbit LPDDR'er i 20nm teknologi
- • SemiSouth sampler første 650V SiC JFETs
- • Digi-Key i globalt samarbejde med t-Global Technology
- • austriamicrosystems bliver til 'ams'
- • Find spændende apps til OrCAD og Allegro på nettet
- • Future lancerer energy harvesting testplatform
- • HDMI bridge-IC strømliner HD-konnektiviteten
- • Box med display
- • Ny standard for trådløs opladning i støbeskeen
- • Stor opbakning til nye M2M standard i 'white space' området
- • AMD Embedded G-Series undestøtter Windows RTOS
- • Ny 600V IGBT platform
- • COM-modul med næste generation Atom dual-core processorer
- • Danfoss afhænder datterselskab
- • Renesas hos RS