
Ny Arduino-inspireret udviklingsplatform
FTDI udvider firmaets såkaldte Vinco udviklingsplatform med omfattende 'pakke', der inkluderer hardware, firmware og debug elementer (in english).
USB solutions specialist Future Technology Devices International Limited (FTDI) has further strengthened its Arduino-inspired Vinco platform (which was first announced in November 2010) with the introduction of the VNCLO-START1 kit.
This comprehensive new development environment based on the company’s Vinculum-II (VNC2) dual channel USB Host/Device controller effectively gives engineers everything they need for developing next generation embedded systems.
The VNCLO-START1 kit is made up of a Vinco motherboard and a VNC2 debug/programming module. An optional accessory pack that expands this development kit even further is the VNCLO-SHLD-1A prototyping board accompanied by a set of interconnect, optoelectronic and passive components with which engineers can create their own I/O application boards (or ‘shields’) in line with the highly popular open-source Arduino concept.
The Vinco VNCLO-START1 kit is further supported by a set of free to download libraries that include USB Host/Device drivers and an easy to use software development tool chain (consisting of a ‘C’ compiler, assembler, and debugger) for generating firmware.
The Vinco motherboard integrates an 8-channel, 10-bit ADC, simplifying connection to sensors, actuators and other analogue devices. It supports 38 general-purpose input/output connections. The Vinculum-II controller chip at the heart of the board integrates a 16/32-bit (instruction/data) MCU core, 16kB of RAM and 256kB of Flash Memory, along with a range of interfaces (UART, SPI, GPIO, FIFO and PWM).
The VNCLO-START1 kit is priced at US$44.44 for one off purchases.
http://www.ftdichip.com/Support/Documents/DataSheets/Modules/DS_Vinco.pdf
Relaterede nyheder
- • AMD udvider APU platformen med ny R-serie
- • Box med display
- • COM-modul med næste generation Atom dual-core processorer
- • Nyt kompakt COM modul fra VIA
- • Nye COM Express moduler med Atom E620/E680
- • Udviklingsplatform til motorstyringer
- • Texim i Danmark er ny Aaeon distributør
- • COM Express type 6 moduler med nyeste Intel Core processorer
- • Ny generation af analoge front-ends til energimåling
- • Mouser lagerfører nyt Android udviklingskit
- • Motherboard med AMD Fusion APU'er
- • VIA lancerer første QSeven modul
- • Industriel touchdisplay med optisk bonding-teknologi
- • Ny funktioner til den Arduino-inspirerede Vinco platform
- • Pico-ITX motherboard med dual-core ARM Cortex A9 processor
Seneste nyheder
- • Step-down konverter opererer med 96 procent effektivitet
- • Maxwell Technologies hos Digi-Key
- • Højeffektive DC/DC-konvertere i brick-format
- • Farnell udvider med GNSS/GPS receivere
- • Fuld HD LCD-modul med stor betragningsvinkel
- • Ny teknologi skræmmer fugle væk fra markerne
- • Silicon Labs køber 2,4 GHz specialisten Ember
- • Touch platform emulerer fysiske trykknapper
- • AMD udvider APU platformen med ny R-serie
- • Ericsson klar med ny generation af powermoduler
- • Første 4 Gbit LPDDR'er i 20nm teknologi
- • SemiSouth sampler første 650V SiC JFETs
- • Digi-Key i globalt samarbejde med t-Global Technology
- • austriamicrosystems bliver til 'ams'
- • Find spændende apps til OrCAD og Allegro på nettet
- • Future lancerer energy harvesting testplatform
- • HDMI bridge-IC strømliner HD-konnektiviteten
- • Box med display
- • Ny standard for trådløs opladning i støbeskeen
- • Stor opbakning til nye M2M standard i 'white space' området
- • AMD Embedded G-Series undestøtter Windows RTOS
- • Ny 600V IGBT platform
- • COM-modul med næste generation Atom dual-core processorer
- • Danfoss afhænder datterselskab
- • Renesas hos RS