
Chipsensor bruges til gasdetektion
Imec og Holst Centre har udviklet en low-power gas sensorchip, der kan bruges i forbindelse med opbygning af autonome trådløse sensorer (in english).
Imec and Holst Centre have developed very sensitive integrated sensing elements for gas detection. The polymer-coated microbridges in high-density arrays can detect ppm-level concentrations of vapors using on-chip integrated read-out techniques.
The demonstrated technology is very suitable for miniaturization of electronic nose devices thanks to the low power consumption (<1 mW/bridge) and small form factor.
Wireless sensor nodes that can chemically detect gaseous compounds are rapidly gaining interest from markets such as food monitoring, healthcare and safety. One of the main gas sensing approaches in uncontrolled environments is the identification of vapors ('smells') using multiple sensing elements ('receptors'), in a system that is often referred to as an 'electronic nose' or 'e-nose'.
An accurate e-nose requires small, integrated, low-power detectors with individually tuned chemical coatings. Current solutions, like chemi-resistors or quartz crystals are however not scalable or power-efficient enough to build low-power small form factor e-noses.
Imec and Holst Centre have developed a new generation of microbridges with embedded individual piezoelectric 'shakers' in a high-density array with very high fabrication yield. The novel design allows for rapid coating of a range of absorbents on individual microbridges using commercial inkjet printing technology.
The suspended structures vibrate individually, and changes in their modes of vibration (resonances) are monitored as an indication of vapor absorption in their coatings. Due to the very high length-to-thickness ratio of the microbridges, imec and Holst Centre’s novel gas sensor chip has a high sensitivity to low-concentration vapors. Moreover, by implementing integrated piezoelectric read-out schemes, ultra-low power operation could be demonstrated.
Current work is ongoing to integrate the structures with low-power analog read-out circuits and to demonstrate simultaneous measurements from multiple structures. This truly low-power miniaturized implementation of an e-nose technology can be used in current applications such as wine and cheese monitoring, but could in the future
also help sniff-out human conditions such as asthma, lung cancer, and kidney diseases.
Relaterede nyheder
- • Ny teknologi skræmmer fugle væk fra markerne
- • Silicon Labs køber 2,4 GHz specialisten Ember
- • austriamicrosystems bliver til 'ams'
- • Future lancerer energy harvesting testplatform
- • Ny standard for trådløs opladning i støbeskeen
- • Stor opbakning til nye M2M standard i 'white space' området
- • Danfoss afhænder datterselskab
- • Microsoft vil være med til at nedbryde 'memory-muren'
- • Hjertesensorer integreres i et 'armbåndur'
- • ARM Cortex-A9 test chip bryder 3GHz barrieren
- • Widex nomineret for banebrydende opfindelse
- • EnOcean vil have fokus på energy-harvesting i uddannelsesmiljøerne
- • Tre kineiske mobilproducenter rykker ind på top-10 listen
- • Top-applikationer for 'tingenes internet'
- • Ministerbesøg på HPI
Seneste nyheder
- • Step-down konverter opererer med 96 procent effektivitet
- • Maxwell Technologies hos Digi-Key
- • Højeffektive DC/DC-konvertere i brick-format
- • Farnell udvider med GNSS/GPS receivere
- • Fuld HD LCD-modul med stor betragningsvinkel
- • Ny teknologi skræmmer fugle væk fra markerne
- • Silicon Labs køber 2,4 GHz specialisten Ember
- • Touch platform emulerer fysiske trykknapper
- • AMD udvider APU platformen med ny R-serie
- • Ericsson klar med ny generation af powermoduler
- • Første 4 Gbit LPDDR'er i 20nm teknologi
- • SemiSouth sampler første 650V SiC JFETs
- • Digi-Key i globalt samarbejde med t-Global Technology
- • austriamicrosystems bliver til 'ams'
- • Find spændende apps til OrCAD og Allegro på nettet
- • Future lancerer energy harvesting testplatform
- • HDMI bridge-IC strømliner HD-konnektiviteten
- • Box med display
- • Ny standard for trådløs opladning i støbeskeen
- • Stor opbakning til nye M2M standard i 'white space' området
- • AMD Embedded G-Series undestøtter Windows RTOS
- • Ny 600V IGBT platform
- • COM-modul med næste generation Atom dual-core processorer
- • Danfoss afhænder datterselskab
- • Renesas hos RS