Nyt flip-flop kredsløb giver markant lavere effektforbrug
Toshiba udvikler flip-flop kredsløb, der bruger 77 procent mindre effekt end eksisterende implementeringer, hvilket kan revolutionere de næste generationer af systemchips (in english).
Toshiba Corporation has developed a new flip-flop circuit using 40nm CMOS process that will reduce power consumption in mobile equipment. Measured data verifies that the power dissipation of the new flip-flop is up to 77% less than that of a typical conventional flip-flop and that it achieves a 24% reduction in total power consumption when applied to a wireless LAN chip.
A flip-flop is a circuit that temporarily stores one bit of data during arithmetic processing by a digital system-on-a-chip (SoC) incorporated in mobile equipment and other digital equipment. As a typical SoC uses 100,000 to 10 million flip-flops they are an essential part of an SoC design.
A typical flip-flop incorporates a clock buffer to produce a clock inverted signal required for the circuit’s operation. When triggered by a signal from the clock, the clock buffer consumes power, even when the data is unchanged.
In order to reduce this power dissipation, a power-saving design technique called clock gating is widely used to cut delivery of the clock signal to unused blocks. However, after applying the clock gating, the flip-flop active rate, a measure of data change rate per clock, is only 5-15%, indicating that there is still plenty of room for further power reduction.
In order to save power, Toshiba changed the structure of the typical flip-flop and eliminated the power-consuming clock buffer. This approach brings with it the problem of data collision between the data writing circuitry and the state holding circuitry in the flip-flop, which Toshiba overcame by adding adaptive coupling circuitry to the flip-flop.
A combination of an nMOS transistor and a pMOS ransistor, this circuitry adaptively weakens state-retention coupling and prevents collisions. Despite the addition of the adaptive coupling circuitry, overall simplification of the basic flip-flop configuration reduces the transistor count from 24 to 22, and the cell area is less than that of the conventional flip-flop.
The achievement will be announced on February 23 (local time) at the 2011 IEEE International Solid-State Circuits Conference (ISSCC) now being held in the United States.
Relaterede nyheder
- • Ny teknologi skræmmer fugle væk fra markerne
- • Silicon Labs køber 2,4 GHz specialisten Ember
- • austriamicrosystems bliver til 'ams'
- • Future lancerer energy harvesting testplatform
- • Ny standard for trådløs opladning i støbeskeen
- • Stor opbakning til nye M2M standard i 'white space' området
- • Danfoss afhænder datterselskab
- • Microsoft vil være med til at nedbryde 'memory-muren'
- • Hjertesensorer integreres i et 'armbåndur'
- • ARM Cortex-A9 test chip bryder 3GHz barrieren
- • Widex nomineret for banebrydende opfindelse
- • EnOcean vil have fokus på energy-harvesting i uddannelsesmiljøerne
- • Tre kineiske mobilproducenter rykker ind på top-10 listen
- • Top-applikationer for 'tingenes internet'
- • Ministerbesøg på HPI
Seneste nyheder
- • Step-down konverter opererer med 96 procent effektivitet
- • Maxwell Technologies hos Digi-Key
- • Højeffektive DC/DC-konvertere i brick-format
- • Farnell udvider med GNSS/GPS receivere
- • Fuld HD LCD-modul med stor betragningsvinkel
- • Ny teknologi skræmmer fugle væk fra markerne
- • Silicon Labs køber 2,4 GHz specialisten Ember
- • Touch platform emulerer fysiske trykknapper
- • AMD udvider APU platformen med ny R-serie
- • Ericsson klar med ny generation af powermoduler
- • Første 4 Gbit LPDDR'er i 20nm teknologi
- • SemiSouth sampler første 650V SiC JFETs
- • Digi-Key i globalt samarbejde med t-Global Technology
- • austriamicrosystems bliver til 'ams'
- • Find spændende apps til OrCAD og Allegro på nettet
- • Future lancerer energy harvesting testplatform
- • HDMI bridge-IC strømliner HD-konnektiviteten
- • Box med display
- • Ny standard for trådløs opladning i støbeskeen
- • Stor opbakning til nye M2M standard i 'white space' området
- • AMD Embedded G-Series undestøtter Windows RTOS
- • Ny 600V IGBT platform
- • COM-modul med næste generation Atom dual-core processorer
- • Danfoss afhænder datterselskab
- • Renesas hos RS