Komplet LTE-platform
Ny DSP fra TI med tre DSP-kerner, der hver opererer ved 1,2 GHz, baner vej for implementering af nye slagkraftige LTE-platforme med afsæt i allerede udviklede basestations designs (in english).
Addressing the MIPS-intensive LTE (Long Term Evolution) wireless standard, Texas Instruments (TI) has developed the 1.2GHz TMS320TCI6487, a three core digital signal processor running at 3.6GHz coupled with a powerful software library that delivers all of the performance necessary to support LTE’s complex algorithms.
With TI’s new LTE solution, OEMs can extend their current basestation platforms to include new features and more complex algorithms without designing a new board. In addition, TI’s optimized software library for LTE leverages specialized accelerators and instructions that further improve the efficiency of today’s systems.
- More than 18 carriers around the world have recently announced plans to deploy LTE to the cumulative tune of $8.5 billion by 2012 for wireless infrastructure equipment, says Jagdish Rebello, director and principal analyst of consumer and wireless research, iSuppli.
- A key driver for LTE deployment is the consumer’s insatiable demand for data-intensive applications running on mobile internet devices or smartphones, including interactive remote games, streaming video and location-based applications, which require significantly more bandwidth and no tolerance for latency. To meet these challenging network requirements while keeping an eye on costs, basestation OEMs and carriers need a powerful, scaleable solution similar to the one TI is providing.
- Proof that TI delivers parts with our customer’s architecture in mind and provides the most efficient path to deployment, our 1GHz TCI6487 is currently used in eight of the top ten LTE OEM systems going through development, lab, and field trials today, says Kathy Brown, general manager of TI’s wireless basestation infrastructure group.
- By increasing the performance of our C64x+based digital signal processor (DSP), we enable our customers to support new features and requirements quickly and effectively, reducing cost and accelerating time to market.
To achieve a successful LTE deployment, robust software is a requirement. TI’s third generation LTE software library release includes optimized functions for all necessary signal processing elements. In addition, TI has released software to use on-chip acceleration to support decoding the uplink channel quality information (CQI), thereby saving up to 1 GHz of DSP processing – a savings equivalent to adding an additional core to the DSP.
A complete physical layer reference designincorporating TI’s LTE library is available from Tata Elxsi and mimoOn. TI also offers a reference platform from Commagility, enabling customers to quickly evaluate their networks and optimize system design, speeding
LTE deployments. In addition to the reference platform, TI provides the complete analog signal chain for LTE, including data converters, RF products, power management, clocks and amplifiers.
Features and benefits
The TCI6487 contains three DSP cores, each running at 1.2 GHz. Each core has its own dedicated 1 Mbyte of L2 with 32k of L1 data and program cache minimizing off-chip memory access and enabling efficient software architectures. TI’s easy-to-use and efficient compiler tools reduce the time required to develop and test new software features.
The TCI6487 includes additional high performance accelerators and peripheral interfaces, which are optimized for cellular infrastructure products. Each DSP core contains one RSA unit that can accelerate the decoding of LTE CQI information – a savings of up to 1 GHz per sector for 20 MHz LTE systems. The flexibility and ease of use of TI DSPs makes this product ideal for multi-standard designs or as the core technology for multiple, targeted designs.
In addition to LTE software libraries, TI provides optimized libraries for WiMAX and WCDMA to further enable multi-standard developments. These libraries enable higher channel density as well as lower power per channel. Developed and tested within TI’s carrier-class environment, the inclusion of this software allows basestation OEMs to better focus on their system level solutions.
The 1.2 GHz TCI6487 will be sampling in 1Q09 to targeted cellular infrastructure customers and will be available to the broader market in 2Q09. It will be on display at the Mobile World Congress Conference in Brcelona, February 16-19, Hall 8, TI’s booth #8A84.
Relaterede nyheder
- • Slagkraftige multicore DSP'er
- • Nye low-power DSP-arkitektur fra CEVA
- • PandaBoard ES åbner nye muligheder
- • Xilinx tilbyder designværktøj med udvidet DSP-support
- • Low cost DSP og udviklingskit skal åbne nye markeder
- • Texas Instruments vil bekæmpe IP og software pirater
- • Simuleringsmodeller til CEVA's DSP-kerner
- • TI gør det lettere af designe DSP-applikationer
- • Ny biomedicinsk signalprocessor med kolossalt potentiale
- • CEVA udvider familien af DSP-kerner
- • TI introducerer ekstrem slagkraftig DSP
- • Nye værktøjer gør det let at flytte ARM-applikationer til en DSP
- • TI introducerer nye low-power DSP'er
- • CEVA introducerer 1 GHz DSP-kerne
- • ON Semiconductor køber DSP-firma
Seneste nyheder
- • Kontron satser stort på den nyeste Intel Core i7 processorteknologi
- • LG demonstrerer 55 tommer OLED tv i Europa
- • Exova Metech tilbyder nu kalibrering af ESD pistoler
- • Mouser udbygger med leverandør af antenner til M2M applikationer
- • EBV-magasin om funktionel sikkerhed
- • Bluetooth audiomodul til trådløse højttalersystemer
- • Techno-Matic i nyt forretningsområde
- • Årets Elektropris er uddelt
- • Første SAR A/D-konverter med SPICE model
- • Premier Farnell får ny chef
- • Step-down konverter opererer med 96 procent effektivitet
- • Maxwell Technologies hos Digi-Key
- • Højeffektive DC/DC-konvertere i brick-format
- • Farnell udvider med GNSS/GPS receivere
- • Fuld HD LCD-modul med stor betragningsvinkel
- • Ny teknologi skræmmer fugle væk fra markerne
- • Silicon Labs køber 2,4 GHz specialisten Ember
- • Touch platform emulerer fysiske trykknapper
- • AMD udvider APU platformen med ny R-serie
- • Ericsson klar med ny generation af powermoduler
- • Første 4 Gbit LPDDR'er i 20nm teknologi
- • SemiSouth sampler første 650V SiC JFETs
- • Digi-Key i globalt samarbejde med t-Global Technology
- • austriamicrosystems bliver til 'ams'
- • Find spændende apps til OrCAD og Allegro på nettet