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Send til en ven   Udskriv26/1 2011 kl. 13:30
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Envelope trackning skal ind i mobiltelefonen

Engelske Nujira er blandt pionerne indenfor Envelope Trackning. I den første fase er der fokuseret på teleinfrastrukturen, men nu er blikket for alvor rettet mod mobiltelefoner (in english).

Nujira today unveiled its roadmap for putting its Coolteq Envelope Tracking technology into 800 million handsets worldwide by 2016. The company is announcing its second generation handset test chip at Mobile World Congress in Barcelona, in February 2011, as well as  the completion of an Envelope Tracking Processor IC for cellular network infrastructure.

Nujira has secured additional funding from its investors to help realise its handset vision, and interest from leading silicon vendors in the handset ecosystem has led to the expansion of its handset engineering team.

Nujira Coolteq.L Envelope Tracking power modulators can save over 1W in an LTE terminal, enabling a single multiband, multimode PA module to transmit 20 MHz 4G signals using less power than today’s single-band 3G PAs. 

In September,  Nujira announced that it had licensed its Coolteq.L handset technology to a Tier 1 semiconductor vendor in the handset ecosystem.  The company is now developing a commercial Envelope Tracking processor IC to replace the DC-DC converter in the handset, which will transform the power consumption of 3.5G and 4G terminals.

- 4G terminals will not work without Envelope Tracking, says Tim Haynes, CEO, Nujira. 
- Using standard power architectures, 4G terminals will use 75% more power than today’s 3G terminals, and require up to seven PA modules to cover the whole of the allocated spectrum. With Envelope Tracking, terminals will use 30%-50% less power and require just two PAs. The case for Envelope Tracking is overwhelming, which is why we are in detailed discussions with OEMs and partners representing more than 70% of the handset market.

Haynes continues:
- Coolteq.L will replace the DC-DC converter and become the standard power architecture for the next generation of handsets, because it is the only power optimisation technology which delivers the high bandwidths and wideband capability needed for 3.5G and 4G.   Nujira Coolteq is PA, baseband, frequency and modulation scheme agnostic. It can deliver significant power savings for any terminal on any 3G or 4G network.

Cellular terminal roadmap

At MWC in February 2011, Nujira is demonstrating its second generation handset test chip to customers and partners. This second generation device has already been delivered to a Tier 1 handset OEM and covers the full 20 MHz LTE bandwidth. Based on this device, Nujira is developing a commercial Envelope Tracking processor IC for release later this year, which can be integrated into 3G, 3.5G and 4G terminals in place of the DC-DC converter. Both devices are compatible with the OpenET Terminal Interface published by the OpenET Alliance.

In Q2 2011, Nujira will release a flexible development platform to support Envelope Tracking implementation. This wideband platform, which covers all bands from 200 MHz to 2700 MHz, will allow immediate evaluation of Coolteq.L modulator IC technology with no development effort. It enables PA vendors and OEMs to measure the benefits of Envelope Tracking across multiple frequency bands, and acts as a reference environment for PA characterisation, PA development and integration of the Envelope Tracking modulators.

Nujira company roadmap

Nujira has expanded its team to 66 to enable the company to support engagements with its handset partners, and has secured an additional £5 million in funding from its existing investors to support its accelerated growth plans. It is opening a Design Centre in Scotland to complement the existing Cambridge and Bath locations.

Nujira infrastructure road-map

Nujira is also announcing that it has received silicon for the first chip in its next-generation cellular infrastructure modulator. The device, known as EPIC (Envelope Tracking Processor IC) is currently in test, and is due to be delivered to Tier 1 customers in Q2 2011.

The key feature of EPIC is its high speed 2.5 Gbps JESD204A OpenET Interface. The device has a 500MHz clock and is manufactured on the TSMC 0.18G process. It is packaged in a 104 pin aQFN. Its companion device, the SWIC, a state-of-the-art SWitchmode power system IC, is taped out and currently in fab.

It integrates two 5MHz PWM (pulse width modulation) controllers. Based on EPIC device and SWIC, Nujira will create a second generation Envelope Tracking power modulator that offers better performance at lower cost in a smaller module.

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