
Nyt testsæt til udvikling af trådløst kommunikationsudstyr
Agilent Technologies nye E5515E 8960 Series 10 trådløse kommunikations testsæt retter sig mod udviklere af 2G/3G/3.5G systemer, der opererer med maksimale datahastigheder (in english).
Agilent Technologies has announced the new E5515E 8960 Series 10 wireless communications test set, designed for R&D engineers who need to stress their 2G/3G/3.5G designs at the maximum data rates.
The E5515E, an enhancement to the industry-preferred 8960 wireless test set, is equipped with dual downlink paths, a more powerful processor and other significant hardware improvements.
It includes advanced features such as sustained 42-Mb/sec DC HSDPA throughput and extensive handovers between 2G/3G and LTE, for comprehensive 2G/3G/3.5G/LTE testing together with the Agilent PXT E6621A wireless communication test set for LTE. In addition, the E5515E wireless test set supports the latest TD SCDMA advancements such as TD HSDPA 2.8-Mb/sec IP data connections, TD HSUPA signaling and test-mode connections, and TD SCDMA protocol logging.
- With dual RF downlink paths, greater processing capability and more memory, the new E5515E is equipped with even more power to meet the challenges of 3.5G wireless device development, says Garrett Lees, marketing manager of the Mobile Broadband Operation at Agilent.
- The two downlink paths allow testing of DC HSDPA at the maximum 42-Mb/sec data rate and support testing of future multiple-output technologies.
The E5515E wireless test set is designed to meet the ever increasing demands of the wireless R&D segment of the mobile broadband industry. It complements the currently available E5515C, widely used for both R&D and high-volume manufacturing test. The E5515C continues to offer robust, repeatable and standards-compliant 2G/3G/3.5G RF measurements for both R&D and manufacturing. Existing E5515C test sets can be upgraded to E5515E hardware to support the latest 3.5G technologies such as 42-Mb/sec DC HSDPA.
Altoo Measurement Science ApS
Phone: 70 13 15 15
Web: www.altoo.dk
Relaterede nyheder
- • Brüel & Kjær og Agilent samarbejder om 'voice-over-LTE' testsystemer
- • Svensk institut tilbyder højspændings-impulstest
- • Rohde & Schwarz og Hameg styrker relationerne
- • Tektronix kan teste Thunderbolt
- • High-voltage SourceMeter
- • Agilent klar med realtime oscilloskop med 63 GHz analog båndbredde
- • Signalanalysator til design og verifikation af wireless chips
- • Ny generation af HALT/HASS testsystemer
- • Teknologidag om PXI
- • Test af Bluetooth Low-Energy applikationer
- • Instruments skal sælge Acculogic ATE-udstyr i Norden
- • Software kan teste apparaters standby forbrug
- • Tektronix introducerer nye mixed-signal oscilloskoper
- • Agilent udvider 3000 X-serien med 1GHz-versioner
- • Altoo udvider med ETS Lindgreen
Seneste nyheder
- • Europæisk chipmarked udvikler sig solidt
- • Kontron satser stort på den nyeste Intel Core i7 processorteknologi
- • LG demonstrerer 55 tommer OLED tv i Europa
- • Exova Metech tilbyder nu kalibrering af ESD pistoler
- • Mouser udbygger med leverandør af antenner til M2M applikationer
- • EBV-magasin om funktionel sikkerhed
- • Bluetooth audiomodul til trådløse højttalersystemer
- • Techno-Matic i nyt forretningsområde
- • Årets Elektropris er uddelt
- • Første SAR A/D-konverter med SPICE model
- • Premier Farnell får ny chef
- • Step-down konverter opererer med 96 procent effektivitet
- • Maxwell Technologies hos Digi-Key
- • Højeffektive DC/DC-konvertere i brick-format
- • Farnell udvider med GNSS/GPS receivere
- • Fuld HD LCD-modul med stor betragningsvinkel
- • Ny teknologi skræmmer fugle væk fra markerne
- • Silicon Labs køber 2,4 GHz specialisten Ember
- • Touch platform emulerer fysiske trykknapper
- • AMD udvider APU platformen med ny R-serie
- • Ericsson klar med ny generation af powermoduler
- • Første 4 Gbit LPDDR'er i 20nm teknologi
- • SemiSouth sampler første 650V SiC JFETs
- • Digi-Key i globalt samarbejde med t-Global Technology
- • austriamicrosystems bliver til 'ams'