Send til en ven   Udskriv25/5 2010 kl. 11:06

Integrerede baluns erstatter diskret implementering

STMicroelectronics lancerer integrerede baluns, der gør det muligt at reducere PCB-arealet i Bluetooth designs med 70 procent (in english). 

Two new ICs from STMicroelectronics (ST) allow designers to connect an antenna to a Bluetooth transceiver using a single chip, making Bluetooth-enabled products simpler, smaller and easier to build.

The BAL-2593D5U and BAL2690-D3U are integrated baluns, used to convert the antenna signal to a balanced pair of signals as required by the Bluetooth transceiver. As replacements for traditional baluns built with discrete components, the new devices occupy up to 70% less printed-circuit-board area, simplify design and assembly, and ensure better balanced signal channels with low losses, thereby improving wireless performance.

The ICs comprise Integrated Passive Devices fabricated using ST’s proven IPD-on-glass process, which delivers more predictable RF performance compared to other integrated baluns; some of which require additional external matching components.

The BAL-2593D5U is optimized for use with the STLC2500D standalone Bluetooth transceiver and STLC2592/3 combo devices, which implement an FM radio tuner enabling users to listen to radio directly on a Bluetooth headset. The BAL-2690D3U is designed to partner the STLC2690, a Bluetooth/FM-tuner combo that also adds a short-range FM transmitter allowing the user to play stored music through a system such as a car radio.

Forrige12345678910Næste

Seneste nyheder

• •  Europæisk chipmarked udvikler sig solidt
• •  Kontron satser stort på den nyeste Intel Core i7 processorteknologi
• •  LG demonstrerer 55 tommer OLED tv i Europa
• •  Exova Metech tilbyder nu kalibrering af ESD pistoler
• •  Mouser udbygger med leverandør af antenner til M2M applikationer
• •  EBV-magasin om funktionel sikkerhed
• •  Bluetooth audiomodul til trådløse højttalersystemer
• •  Techno-Matic i nyt forretningsområde
• •  Årets Elektropris er uddelt
• •  Første SAR A/D-konverter med SPICE model
• •  Premier Farnell får ny chef
• •  Step-down konverter opererer med 96 procent effektivitet
• •  Maxwell Technologies hos Digi-Key
• •  Højeffektive DC/DC-konvertere i brick-format
• •  Farnell udvider med GNSS/GPS receivere
• •  Fuld HD LCD-modul med stor betragningsvinkel
• •  Ny teknologi skræmmer fugle væk fra markerne
• •  Silicon Labs køber 2,4 GHz specialisten Ember
• •  Touch platform emulerer fysiske trykknapper
• •  AMD udvider APU platformen med ny R-serie
• •  Ericsson klar med ny generation af powermoduler
• •  Første 4 Gbit LPDDR'er i 20nm teknologi
• •  SemiSouth sampler første 650V SiC JFETs
• •  Digi-Key i globalt samarbejde med t-Global Technology
• •  austriamicrosystems bliver til 'ams'