Samarbejde om LTE-referencedesign
Continuous Computing og picoChip lancerer i fællesskab et komplet LTE hardware-software referencedesign (in english).
Continuous Computing and picoChip will collaborate to produce a comprehensive Long Term Evolution (LTE) femtocell and picocell reference implementation. The results of the joint work will enable Network Equipment Providers (NEPs) to quickly get to market with a variety of small form factor LTE products, including femtocell and picocell base stations.
Smaller eNodeB products, such as those based on the MicroTCA form factor, are expected to be important for LTE deployments worldwide. In a separate announcement Continuous Computing also discloses that its Trillium LTE software now supports the latest March 2009 3GPP E-UTRA LTE specifications.
Executives from picoChip and Continuous Computing believe that their memorandum of understanding, details of which were disclosed at the LTE World Summit in Berlin, is the industry’s first alliance for LTE femtocells / picocells which extends from a hardware reference design and physical layer implementation (PHY) all the way up through Layer 2 and Layer 3 LTE protocols.
Dozens of operators across the globe have announced support for LTE and are expected to commence subscriber field trials later this year. Continuous Computing and picoChip are uniquely positioned to bring together the key hardware and software technologies required to enable successful LTE implementation. While each of the constituent LTE products in the joint project is currently available from Continuous Computing and picoChip today, pre-integrating them into an optimized reference implementation will save NEPs substantial time and money.
Specifically, Continuous Computing will integrate its Trillium LTE-Uu, S1AP, and X2AP protocol stacks with picoChip’s PC8608 and PC8609 PHY software reference designs running on the picoChip PC7608 hardware platform.
The resulting reference implementation will offer 10MHz channel bandwidth with global application – supporting both time-division duplex (TDD) and frequency-division duplex (FDD) modes of operation – and aggregate throughout performance of up to 86Mbps, a more than 4X improvement over today’s top data rates of 21Mbps with enhanced High Speed Packet Access (HSPA+).
- Small form factor LTE products, such as femtocells and picocells, are expected to be critical to LTE deployments worldwide, says Mike Dagenais, president and CEO of Continuous Computing.
- Having standards-compliant, integrated products can significantly compress NEPs’ development timelines, enabling them to accelerate their participation in the burgeoning LTE market and early operator trials.
- picoChip is at the forefront of LTE infrastructure technology development, building on our core competencies in OFDMA and HSPA femtocells, says Nigel Toon, president and CEO at picoChip.
- The expansion of our collaboration with Continuous Computing on the LTE femtocell and picocell reference design is reaffirmation of our commitment to LTE. In light of our close and successful HSPA femtocell association, Continuous Computing was the obvious choice of partner in bringing our LTE offerings to market quickly and cost-effectively.
Continuous Computing and picoChip first partnered in February 2008 to introduce the industry’s first integrated femtocell reference solution with complete protocol stacks.
Relaterede nyheder
- • Imec demonstrerer 60GHz transceiver med 7Gbit/s datahastighed
- • WiFi devices til sensornetværk
- • 2,4 GHz transceiver sætter ny 'low power' rekord
- • Ny generation af RFID reader-chips
- • Avnet-Memec lancerer ny generation af NFC-løsninger
- • RFID chip med integreret temperatursensor
- • Programmerbar toolkit gør det let at realisere forskellige trådløse protokoller
- • Fuldt kvalificeret Class 2 Bluetooth modul
- • Nu er der 600 certificerede Z-Wave produkter
- • Samsung og FeliCa Networks i NFC-samarbejde
- • RTX klar med ultrakompakt WiFi modul
- • Bluetooth og WiFi integreres i baseband processorerne
- • Bluetooth teknologi til trådløse tags
- • Wireless chips med op til fem forskellige radioer
- • Starterkit skal gøre det lettere at integrere RFID teknologi i produkterne
Seneste nyheder
- • Europæisk chipmarked udvikler sig solidt
- • Kontron satser stort på den nyeste Intel Core i7 processorteknologi
- • LG demonstrerer 55 tommer OLED tv i Europa
- • Exova Metech tilbyder nu kalibrering af ESD pistoler
- • Mouser udbygger med leverandør af antenner til M2M applikationer
- • EBV-magasin om funktionel sikkerhed
- • Bluetooth audiomodul til trådløse højttalersystemer
- • Techno-Matic i nyt forretningsområde
- • Årets Elektropris er uddelt
- • Første SAR A/D-konverter med SPICE model
- • Premier Farnell får ny chef
- • Step-down konverter opererer med 96 procent effektivitet
- • Maxwell Technologies hos Digi-Key
- • Højeffektive DC/DC-konvertere i brick-format
- • Farnell udvider med GNSS/GPS receivere
- • Fuld HD LCD-modul med stor betragningsvinkel
- • Ny teknologi skræmmer fugle væk fra markerne
- • Silicon Labs køber 2,4 GHz specialisten Ember
- • Touch platform emulerer fysiske trykknapper
- • AMD udvider APU platformen med ny R-serie
- • Ericsson klar med ny generation af powermoduler
- • Første 4 Gbit LPDDR'er i 20nm teknologi
- • SemiSouth sampler første 650V SiC JFETs
- • Digi-Key i globalt samarbejde med t-Global Technology
- • austriamicrosystems bliver til 'ams'