Analog, mixed-signal

 

Logik-pakning kan bruges uden step-down maske

Logik-pakning kan bruges uden step-down maske

Nexperia lancerer industrien mindste logikpakning med mindre end 0,4mm pitch, der kan bruges uden kostbar og porøs step-down maske (in english).

Nexperia, a global leader in discretes, logic and MOSFET devices, today announced the four pin X2SON4 package which is the smallest logic package that can be used without requiring an expensive and fragile step-down mask. Therefore, PCB assembly is quicker, easier, more reliable and more cost-effective.

Nexperia developed the X2SON packages - part of its MicroPak package range - to provide the smallest footprint for logic functions while ensuring pad pitch remains 0.4mm or over (step-down masks are only needed under that threshold). The company's low-power AUP, AXP, LV and LVC technology families covering over one hundred logic solutions are now available in X2SON 8, 6, 5 and 4-pin packages.


The new 4-pin X2SON4 package option reduces the footprint of the same function by 44% when compared to 5-pin X2SON5, and by up to 64% when compared to XSON packages.

Michael Lyons, senior product manager at Nexperia explains:
- X2SON4 enables enables the release of smaller buffers and inverters, that were previously only available in 5-pin or 6-pin leadless packages. All our X2SON solutions enable miniaturization without the use of expensive and fragile step down masks. 

As packages become smaller, the pad pitch is reduced - making the use of standard assembly tools difficult. If the pitch is reduced to less than 0.4mm, thinner and delicate step down masks (stencils) are required to apply solder paste. They typically need to be replaced regularly, may also require a different, more expensive solder paste, and the placement of components may be restricted because the mask won't work over the entire board.

X2SON packages from Nexperia require no step-down mask, thus saving manufacturing costs. In addition, the X2SON's larger pad pitch provides greater contact area, resulting in easier component placement, as well as improved joint strength and robustness. Larger pad pitches make it easier to avoid costly assembly problems such as misaligned components, and reduce the risk of short circuits.

The new future-proof X2SON4 logic package also features a low 0.32mm profile and low 0.6mm width and length, suiting space-constrained, portable applications such as IoT, wearables and consumer electronics. Devices are RoHS & dark-green compliant with NiPdAu leadframe finish. Ten AUP and LVC logic buffers / inverters are currently available from Nexperia in the new X2SON4 ( SOT1269-2 ) package.
28/8 2018
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