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Succesfuld waferscale integration af InP-lasere, forstærkere og fotonikThe InP DFB laser diodes were bonded onto a 300mm silicon photonics wafer with an alignment precision within 500nm.

Succesfuld waferscale integration af InP-lasere, forstærkere og fotonik

Imec er i tæt samarbejde med Sivers Photonics og ASM AMICRA lykkedes med en hybrid integration af InP-lasere, forstærkere og silicium-baseret fotonik på en 300mm wafer (in english).

imec, a world-leading research and innovation center in nanoelectronics and digital technologies, has together with Sivers Photonics (formerly CST Global, and a subsidiary of Sivers Semiconductors) - a UK-based high-volume manufacturer of III-V compound semiconductors for photonics products - and ASM AMICRA Microtechnologies - a worldwide leading supplier of ultra-high precision die attach equipment - announced the successful wafer-scale integration of indium-phosphide (InP) distributed feedback (DFB) lasers from Sivers’ InP100 platform onto imec’s silicon photonics platform (iSiPP).


Using ASM AMICRA’s latest NANO flip-chip bonder tool, the InP DFB laser diodes were bonded onto a 300mm silicon photonics wafer with an alignment precision within 500nm, enabling reproducible coupling of more than 10mW of laser power into the silicon nitride waveguides on the silicon photonics wafer.

Supported by its partners, imec will offer this technology later in 2021 as a prototyping service, thereby accelerating the adoption of silicon photonics in a wide range of applications from optical interconnects, over LiDAR, to biomedical sensing.

7/6 2021