Embedded, boards og moduler

 

Single board computer med 13. generations Intel Core U-series processorer

Single board computer med 13. generations Intel Core U-series processorer

Kontron præsenterer under navnet 3.5”-SBC-RPL den seneste generation af firmaets familie af 3.5” single board computere (in english).

Del artiklen på

Kontron present the latest generation of its 3.5”-SBC product family, named 3.5”-SBC-RPL. The 3.5”-SBC-RPL is a single board computer driven by hybrid-core 13th Gen Intel Core U-Series and Intel U-Series Processors (codenamed Raptor Lake U) which enable an optimal synergy between performance and efficiency.

With integrated Intel Iris Xe Graphics, AI acceleration features and real-time computing capability on the same chip, the board can help system developers build a compact edge system that requires excellent graphics, efficient computing, real-time processing and/or AI acceleration for a variety of applications, such as smart manufacturing, healthcare, retail and smart city. Samples will be available to customers in January 2025.


The 3.5”-SBC-RPL leverages hybrid computing architecture, combining performance and efficiency cores within the 13th Gen Intel Core U-Series processors. This enables intelligent workload management by assigning demanding tasks to performance cores and energy-efficient tasks to efficiency cores, optimizing performance per watt. The design allows smaller thermal solutions and is ideal for compact systems. The new 3.5”-SBC-RPL Single Board Computer offer multiple embedded controller features and uses advanced technology components.

With integrated Intel Iris Xe Graphics, the 3.5”-SBC-RPL supports 8K resolution at 60 fps via two DisplayPort connectors. It can extend to four displays through additional ports, ideal for video walls and control rooms. An eDP/LVDS combo connector is available for all-in-one systems. The GPU supports up to 96 execution units, enabling AI acceleration for edge devices, alongside Intel Deep Learning Boost and Intel Gaussian & Neural Accelerator 3.0, delivering cost- and power-efficient AI computing.

Next-gen low-latency data transfer and enhanced scalability

The board incorporates two DDR5 SO-DIMM sockets (up to 5200 MHz), dual 2.5 GbE LAN Intel i226 controllers, and four USB 3.2 Gen 2 connectors (10 Gbps). Certain variants feature Intel Time Coordinated Computing (TCC) and IEEE 802.1 Time-Sensitive Networking (TSN), ensuring real-time, low-latency communication within and between systems, critical for real-time AI processing. The configurable TDP (12 W to 28 W) allows flexibility in system design based on cooling solutions.

The 3.5”-SBC-RPL offers three M.2 slots for SSD, WLAN, Bluetooth, WWAN, and other expansions. A board-to-board connector allows developers to add one of the expansion boards, named 3.5"-eIO, for extra I/O ports or features, including additional display (DP & HDMI) connectors and LAN ports.

The 3.5"-eIOs support both standard and industrial operating temperature ranges and are compatible with the 3.5”-SBC-RPL, 3.5”-SBC-ADN, 3.5”-SBC-AML as well as previous generations the 3.5"-SBC-EKL and the 3.5"-SBC-TGL. 3.5”-eIO Series expansion boards enable faster time-to-market and reduced development costs.

Rugged and secure

Designed for harsh environments, the 3.5”-SBC-RPL supports a wide input voltage range (9 V to 36 V) for unstable power conditions and integrates a TPM 2.0 security chip for enhanced hardware-level security, protecting user data, network access, and ensuring operational integrity against cyber threats. S

Some variants are designed for continuous operation (24/7) under harsh operating conditions and on high system load. Seven variants are available, in both industrial-grade (-40 °C to 85 °C) and commercial-grade (0 °C to 60 °C) temperature ranges, using Intel Core i7, i5, i3, and U300E processors.

3.5”-SBC-RPL ensures an extended long-term availability of up to 10 years from the release date, due to embedded key components and is CE, FCC, ICES, UKCA & UR (UL Recognized) compliant.

21/10 2024
Produktlinks
Find din leverandør:

Apparatkonstruktion

ARM/Xscale

Box

COM Express

COMe

Computer-On-Modules (COM)

Cooling Solutions

CPU

Elektronikudvikling

Flash

I/O Moduler

Memory

Motherboards

Panel pc

Qseven

SBC

Single Board Computers (SBC)

Slot CPU Card

SMARC

Solid State Disk (SSD)

SOM

Tilføj dit firma

Webinarer, events og messer

Mest læste


Læs magasinet

Læs magasinet

Nyeste Nyheder