Speciel Flash-hukommelse optimeret til RZ/A2M microprocessorer

Speciel Flash-hukommelse optimeret til RZ/A2M microprocessorer

Dialog Semiconductor annoncerer kompatibilitet mellem firmaets EcoXiP Octal xSPI Flash hukommelse og Renesas’ højtydende RZ/A2M microprocessor (in english).

Del artiklen på

Dialog Semiconductor has announced that its EcoXiP octal xSPI non-volatile memory (NVM) which was added to Dialog’s portfolio through its recent acquisition of Adesto Technologies, is now optimized to be used with Renesas’ RZ/A2M Arm-based microprocessors (MPUs).

Customers of the RZ/A2M, which is designed for high-speed processing of embedded AI imaging in smart appliances, service robots, and industrial machinery, can take advantage of the system-level benefits of EcoXiP, the industry’s lowest power octal xSPI NOR flash device.

For systems leveraging the Renesas MPU, EcoXiP enables ultra-fast boot for instant-on capability and real-time system responsiveness. It also offers efficient storing of AI weights for low-power AI inference. In addition, EcoXiP enables MPUs such as the RZ/A2M to operate in eXecute-in-Place (XiP) mode for code execution directly from external flash memory.

- With RZ/A2M MPUs featuring Renesas’ exclusive Dynamically Reconfigurable Processor (DRP) technology, we bring real-time, low-power image processing to IoT endpoints, says Shigeki Kato, Vice President of Enterprise Infrastructure Business Division at Renesas.

- We are delighted to welcome Dialog’s EcoXiP device to the ever-growing ecosystem around our MPUs. We look forward to working with Dialog in order to show how our MPUs and EcoXiP can benefit a growing number of applications, accelerating intelligence at the IoT edge.

- Together with Renesas’ RZ/A2M, we are able to demonstrate multiple facets of EcoXiP’s performance and power consumption benefits, says Gideon Intrater, CTO, of the Industrial Business at Dialog.

- With its RZ/A2M, Renesas is addressing the need for more powerful processing and real-time operation to enable embedded AI imaging in IoT endpoints. As an external companion flash memory, EcoXiP provides a balanced tradeoff of performance and power advantages for a broad range of emerging IoT applications that can benefit from AI imaging.

EcoXiP is one of the first NOR flash devices to support the Expanded Serial Peripheral Interface (xSPI) communication protocol, with concurrent read-while-write (RWW) capability, enabling higher transfer rates and lower latency for flash memory, offering significant advantages for over-the-air updates, and data logging.

EcoXiP eliminates the need for expensive on-chip embedded flash in a broad range of emerging applications, and hits the sweet spot for power, system cost and performance. It achieves significantly lower power consumption compared to other octal devices, and dramatically higher performance versus quad SPI devices.

EcoXip is available in volume production and at all major distributors. Avnet, Arrow, Digi-Key, and Future.


17/8 2020
Find din leverandør:



DRAM Modules






Tilføj dit firma

Webinarer, events og messer

Mest læste

Læs magasinet

Læs magasinet

Nyeste Nyheder