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TDK lancerer partnerprogram med fokus på MEMS-sensorer

TDK lancerer partnerprogram med fokus på MEMS-sensorer

Som et centralt element i det nye 'InvenSense Sensor Partner Program' vil TDK og partnere tilbyder referencedesigns, evalueringskit, moduler og softwarealgoritmer med mere (in english).

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TDK announces the InvenSense Sensor Partner Program to empower faster time-to-market and innovation using InvenSense MEMS sensors in IoT, wearable, hearable, AR, VR and robotics applications.

Through these new ecosystem partnerships, more engineers and developers can access leading InvenSense sensor technology along with the reference designs, software solutions and development kits that help them bring product designs to reality.

The InvenSense Sensor Partner Program enables ODMs, OEMs, developers, engineers and tech enthusiasts to work with a wide variety of InvenSense MEMS sensors – motion sensors, industrial motion modules, microphones, pressure sensors and ultrasonic sensors.

Partner reference kits serve as real-world examples of how InvenSense MEMS sensors work with partner products to create more accurate, reliable and efficient solutions across industries. This not only improves time to market but also reduces the cost of ownership for building IoT solutions.

- Renesas is thrilled to be part of the InvenSense program, as they provide a variety of high accuracy sensors that are integrated into Renesas Quick Connect Studio platform. This helps customers quickly develop system solutions for IoT, home automation, consumer and industrial applications, says Pooja Bhadrappanavar, Renesas product marketing lead.

Current InvenSense Sensor Partner Program members include:

Microcontroller/SOC partners

Renesas Electronics  – InvenSense partners with Renesas to empower a wide range of industrial, home electronics and IoT applications. InvenSense MEMS sensors have been integrated on the Renesas Quick Connect platform as a sensor PMOD board (QCIoT-42688P), enabling users to select these sensors to rapidly prototype IoT solutions on Renesas MCU platforms.

The AI Kit from Renesas also comes with the ICM-42670-P PMOD boards and drivers.
Ambiq Micro – InvenSense partners with Ambiq Micro to empower ultra-low-power applications such as wearables and hearables. InvenSense motion sensors and microphones have been integrated on the energy harvesting reference design and ultra-low-power voice activation kits with the latest Apollo510 SOC; Ambiq leverages their low power/high compute leadership into power consumption constrained battery-powered applications, for markets such as healthcare, cargo/human/pet trackers, building access and self-healing conditional factory monitoring.

Qualcomm Technologies – InvenSense is collaborating with Qualcomm Technologies to bring the latest innovation and technology solutions to the robotics market. As the sensor provider for several Qualcomm Robotics Platforms, TDK has worked to create the 'TDK Mezzanine' board supported on all Qualcomm Robotics Platforms. This mezzanine platform allows any customer who plans to utilize Qualcomm Robotics processors to evaluate and develop upon all the necessary sensor and motor controller technology needed for any robotic product quickly and efficiently.

Alif semiconductor – InvenSense partners with Alif Semiconductor to empower high compute AI/ML applications. TDK motion sensors and microphones have been integrated on an AK-E7-AIML AppKit, powered by Alif Ensemble E7 Fusion processor, enabling quick software development and evaluation for Edge Machine Learning use cases.

AI chip partners

Ambarella – InvenSense partners with Ambarella and its AI vision SOCs to enable Electronic Image Stabilization (EIS) for security cameras, video conference cameras and other applications, as well as Robotics simultaneous localization and mapping (SLAM) functions. Ambarella’s entire portfolio of CVflow AI SOC evaluation kits, including the newest CV72S EVK, come with InvenSense motion sensors integrated for evaluation and development of Optical Image Stabilization (OIS) and EIS functions.

AONDevices – InvenSense partners with AONDevices (AON) SOCs to empower ultra-low power voice activation, speech and sound detection applications. InvenSense microphones and motion sensors have been integrated to AON 1100/1120 evaluation kits for quick evaluation and prototyping of voice related applications on TWS, speakers and hearables.

Syntiant – InvenSense partners with Syntiant SOC for acoustic and motion event detection applications. InvenSense motion sensors and microphones are integrated on the RASynBoard which is an ultra-low power, edge AI/ML board, based on a Syntiant Neural Decision Processor, and a Renesas RA6M4 host MCU.

Sensor partners

Isentek – InvenSense partners with Isentek 3D Hall sensors for 9-axis IoT applications such as Asset Tracking, Drones, navigation, e-bikes and more. InvenSense sensors have been integrated on 9-axis evaluation kits DK-42688-9x and DK-42670-9x, with Isentek 3D hall sensor IST8306.
Solution/Software Partners

MindMics – InvenSense partners with MindMics to produce infrasonic earbuds for artifact compression for in-ear heart health monitoring. MM-TW-01WT infrasonic earbuds use the InvenSense 6-axis motion sensor for heart health monitoring while listening to music and taking calls.

Distribution/design house partners

Avnet – Invensense partner with Avnet (an official distributor of TDK) to build RASYN (Renesas Syntiant) AI ML board for predictive maintenance, acoustic event and scene classification, multi sensor fusion applications.

- Ambiq and InvenSense have mutual goals for energy efficiency in battery-powered applications like wearables, hearables, factory automation, and asset trackers. With InvenSense’s ultra-low power sensors and Ambiq’s lowest power microcontrollers, customers can seamlessly develop solutions with a faster time-to-market, explains Mike Kenyon, VP of Sales at Ambiq. 

24/6 2024
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