Nye embedded silicium-baserede kondensatorer
Empower Semiconductor præsenterer tre nye embedded silicium-kondensatorer (ECAPs), der er designet til at honorere kravene i de næste generationer af AI og HPC processorer (in english).
Empower Semiconductor, the world leader in powering artificial intelligence (AI)-class processors has announced the launch of three new embedded silicon capacitors (ECAPs), designed to meet the power integrity demands of next-generation AI and high-performance computing (HPC) processors.
The new ECAP portfolio includes the EC2005P, with 9.34 uF capacitance in a 2mm x 2mm package; the EC2025P, offering 18.68 uF capacitance in a 4mm x 2mm package; and the EC2006P, providing 36.8 uF capacitance in a 4mm x 4mm form factor.
As AI processors push the limits of performance, power delivery has emerged as a critical constraint. Achieving the required power integrity for extreme current densities and ultrafast transient response is no longer realistic with board-level mounted components; embedding capacitors into the processor substrate is now essential.
Empower Semiconductor’s ECAPTM portfolio is leading the industry initiatives to embed high-density silicon capacitors, unlocking the power integrity required to scale next-generation processor performance.
