Siemens og TSMC udbygger samarbejdet

Siemens og TSMC har netop præsenteret et udvidet samarbejde, hvis sigte er at drive ny innovation med hensyn til halvlederdesign og -integration (in english).

Siemens Digital Industries Software has jus announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.

Building on a series of recent collaborations, Siemens has achieved certification for its Calibre nmPlatform software suite – including nmDRC, nmLVS, YieldEnhancer and PERC tools - alongside its Analog FastSPICE (AFS) and Solido solutions, for TSMC’s cutting edge N2P and A16 processes. Additionally, its Calibre 3DSTACK solution is certified for TSMC’s 3DFabric technologies and the 3Dblox standard, advancing silicon stacking and packaging design.

Siemens and TSMC are further advancing tool certifications for the newly announced TSMC N3C technology, building on the available N3P design solutions. The two companies have also initiated collaboration on design enablement for TSMC’s newest A14 technology, laying the groundwork for next-generation designs.

The Siemens and TSMC partnership significantly advances system and semiconductor design for AI, automotive, hyperscale, mobile and other key applications.

- As we continue to pioneer new solutions and redefine the possibilities within the semiconductor industry, our strategic alliance with TSMC remains a cornerstone of our strategy. These advances not only enhance our portfolio but also empower our mutual customers to meet the challenges of tomorrow, explains Mike Ellow, CEO, Siemens EDA, Siemens Digital Industries Software.

- By strengthening our partnership with Siemens, TSMC is empowering customer innovation by combining the excellence of Siemens’ proven design solutions with the performance and power-efficiency advantages of TSMC’s cutting-edge technologies, says Lipen Yuan, Senior Director of Advanced Technology Business Development at TSMC, and he continues:

- Our collaboration with Open Innovation Platform (OIP) ecosystem partners like Siemens is instrumental in pushing the boundaries of what's possible in semiconductor technology moving forward.

Siemens also worked with TSMC through its Calibre 3DStack and AFS to develop design solutions for TSMC’s Compact Universal Photonic Engines (COUPETM) platform by combining Siemens’ expertise and TSMC’s advanced process technologies.

Additionally, Siemens is in the process of certification for its Aprisa software and mPower software, on TSMC’s N2P process, aiming to deliver physical implementation and electromigration / IR-drop analysis for both analog and digital designs.