Ultrakompakt Bluetooth Smart modul
TDK introducerer, hvad firmaet betegner som industriens hidtil mindste Bluetooth Smart modul med dimensioner på kun 4,6 mm x 5,6 mm x 1,0 mm (in english).
TDK Corporation presents an ultra compact Bluetooth low energy module designed for the Bluetooth 4.0 low energy (LE) specification, which is being marketed as Bluetooth Smart. With its miniature footprint of just 4.6 mm x 5.6 mm and slim insertion height of 1.0 mm, the new SESUB-PAN-T2541 Bluetooth 4.0 LE module is the world’s smallest module for Bluetooth Smart devices, according to TDK.Thanks to its compact size, the new module is very well suited for use in emerging wearable devices, a market that market researchers expect will grow rapidly in the near future. Mass production of the SESUB-PAN-T2541 began in February 2014.
The new module is based on TDK’s proprietary SESUB technology (semiconductor embedded in substrate). The Bluetooth IC die is embedded into the thin substrate, and all the peripheral circuitry, including a quartz resonator, bandpass filter and capacitors, is integrated on top. As a result, the new Bluetooth low energy module is nearly 65 percent smaller than modules that employ discrete components. Its substrate layers optimally route all of the I/Os to a BGA on the module’s bottom surface, enabling designers to take full advantage of the chip’s functionality. The new module thus facilitates the hardware design process and allows easy implementation of Bluetooth connectivity simply by connecting it to a power supply and antenna.
The Bluetooth 4.0 LE specification aims at significantly reducing the power consumption of battery powered wireless devices. The new SESUB-PAN-T2541 Bluetooth 4.0 LE module cuts power consumption to about one quarter of that of classic Bluetooth devices. This makes the new TDK module ideally suited for a wide range of wireless healthcare, sport, fitness, home entertainment and wearable devices, where minimal size, weight, and power consumption are essential.
