High-power konnektorer
FCI lancerer high-power konnektorer til backplan og midplane interfaces (in english).
FCI announces the HCI High Power backplane and midplane connector series to address customer demand for additional power at the interface between daughter cards and backplanes or midplanes in chassis-based platforms.
These compact 2- and 3-position power modules utilize recently introduced HCI technology to enable increased linear power density along the daughter card edge. The HCI High Power backplane and midplane connectors are intended for host-to-card applications such as the blade, controller card or line card interfaces in servers, storage enclosures, networking or communications equipment.
These stand-alone modules are designed for use alongside other hard metric (HM) backplane connector families such as FCI's high-performance AirMax VS and ZipLine(TM) connector systems as well as Millipacs® 2mm HM connectors. ZipLine and HCI High Power together offer the highest combination of signal and power density in the market.
HCI High Power modules extend beyond the capability of FCI's proven Hard Metric High Power connector system currently used in many production platforms. HCI High Power is rated for up to 75A per contact without exceeding a 30ºC temperature rise (no airflow).
Individual power contacts are surrounded on four sides by molded housing walls resulting in an added safety feature that ensures adjacent power contacts cannot short together. In addition to conventional 1 x 2 and 1 x 3 power contact configurations, a 2-position module is available with an integrated guide between the two power contacts.
The series offers up to 261A/inch linear power density and is based on standard and cost-effective stamped-and-formed power contact technology.
