TSMC forbedrer 0.13u familie

TSMC har optimeret og forbedret deres 0.13u procesteknologi, hvilket bl.a. kan udnyttes i analoge og powermanagement systemchips (in english).

The 0.13-micron/0.11-micron family now includes a slim standard cell, SRAM and I/O with substantial area reduction and the 0.13-micron process also adopts LD-MOS (5V~20V) on RF platforms to enable analog and power management applications.  The slim platform is available in the third quarter this year while the LD-MOS on RF platforms will be available in Q4 this year.
 
To meet the ever shrinking requirements for basic consumer and RF applications, the slim platform I/O area achieves a 30% reduction and SRAM bit cells demonstrate a 25% reduction when compared with traditional offerings. Furthermore, a 0.13-micron LD-MOS device built upon a RF platform enables SoC designs with power management functionality.
 
- This is another example of how TSMC is committed to enabling more efficient SoC design of wireless, consumer and communications devices using 0.13-micron process technology. The result of these enhancements will spawn the next generation of innovation,  says Dr. Simon Wang, Senior Director of Advanced Technology Business Division. 
 
TSMC\'s investment in R&D for technology and IP portfolios within the 0.13-micron/0.11-micron family now delivers a true 5V with Copper interconnect for the integration of analogue, high-speed DSP, power management and watt-scale class-D amplification. Along with new features development for System-on-Chip design, TSMC also offers a shrunken path to enhance customer\'s competitiveness including sub-node and slim technology platform.