Microcontroller med integreret NFC-teknologi

Microcontroller med integreret NFC-teknologi

Renesas introducerer industriens første microcontroller med integreret Near Field Communication (NFC) teknologi og sikkerhedsfunktioner (in english).

Renesas Electronics has introduced the first product in the RF20 series of microcontrollers (MCUs), the RF21S, that combines on a single chip a near-field communication (NFC)controller supporting the ISO/IEC 18092 international standard along with secure element functionality for use in consumer electronics products such as smartphones and other mobile phones, notebook PCs and PC peripherals.
 
The new RF21S MCU  integrates on a single chip an NFC controller and security functions to enable the capabilities of financial transaction cards, transit system cards, and ID cards; and features an ultra-thin package profile only 0.22 millimeters (mm) thick by using wafer-process-package (WPP) on-wafer packaging technology.

NFC can be extended to cover a broad range of applications, including financial transactions, transit system payment cards, ticketing, and ID cards, and the market for this technology is expected to increase over the next few years. In recent years, adoption of mobile phones incorporating NFC functionality has expanded rapidly.

However, conventional design configurations have required two separate chips for the NFC controller and security element, resulting in the need to reduce the mounting space. Furthermore, there is a demand for more processing power and the elimination of lag time when communicating with the secure element to reduce the transaction time for transit system ticket gates.

The microcontroller integrates Renesas Electronics’ RS-4 secure MCU, an NFC controller, and security functions. Bringing together on a single chip the functions needed in financial transaction cards, transit system cards, and ID cards makes it possible to develop and evaluate systems more efficiently. In addition, support for MIFARE is planned for RF21S.

The single-chip configuration eliminates the need for communication with an external secure element, shortening the time required for gate transactions in transit systems. The RF21S MCU also incorporates measures to thwart security threats such as forgery and tampering, and EMVCo security certification is expected to be obtained soon for RF21S.

As mobile phones integrate more and more functions, the space available for mounting semiconductor devices becomes ever more limited. In response, the RS21S MCU uses Renesas Electronics’ exclusive package technology to achieve an ultra-thin profile (package thickness: 0.22 mm) that allows for more efficient mounting design in mobile phone handsets and other compact devices.

Renesas Electronics plans to supply developers of products such as mobile phones with embedded devices with the software (communication library, host controller interface (HCI), etc.) needed to implement NFC functionality. The company participates in the 'plugfest', an interoperability test event held by the NFC Forum, and makes every effort to develop and supply software that customers can use with confidence. Support will also be available from third-party vendors for middleware required by the host, such as the baseband processor and application processor.

Renesas Electronics will continue to develop and supply new MCU products to the RF20 series in response to evolving market demand, including products with larger memory capacity, more peripheral functions, and even better performance and functionality for high-end applications, and low-cost products for low-end applications.

7/12 2010
  • Lauterbach og MathWorks løfter test af kritiske systemer til det næste niveau

    aktive-komponenter-og-embedded-sw ›Lauterbach, der tilbyder debugging-løsninger til embedded systemer, og MathWorks annoncerer fuld integration af MathWorks Polyspace kodetestning og verifikationsprodukter i Lauterbach’s TRACE32 værktøjer.
  • Europæisk industriel Linux til sikre og suveræne embedded systemer

    Europæisk industriel Linux til sikre og suveræne embedded systemer

    aktive-komponenter-og-embedded-sw ›SYSGO præsenterer ELinOS 8, som er den seneste generation af firmaets industrielle Linux platforme, der er designet specielt til missionskritiske embedded systemer (in english).
  • Unik UWB-chip til positions- og tilstedeværelses-detektering

    Unik UWB-chip til positions- og tilstedeværelses-detektering

    kommunikation-iot-og-cybersikkerhed ›Infineon præsenterer AIROC UWB TSL100, der en single-chip løsning til præcis positionerings- og tilstedeværelses- (presence) detektering (in english).
  • SiC-MOSFET relæer til højspændings power- og testapplikationer

    SiC-MOSFET relæer til højspændings power- og testapplikationer

    aktive-komponenter-og-embedded-sw ›OMRON lancerer nye G3VH SiC-MOSFET-relæer med spændings-ratings på 3.300 V og 1.800 V, der tilbyder fordelene ved solid-state powereffektswitching ved bus- og batterispændinger på op til 1.000 V eller mere (in english).
  • Toshiba er klar med samples af nye 'entry-level' MCU'er

    Toshiba er klar med samples af nye 'entry-level' MCU'er

    aktive-komponenter-og-embedded-sw ›Toshiba kan nu levere design-samples af firmaets TXZ+ Family Entry-Class M4H Group af standard microcontrollere.
  • XJTAG understøtter nu FTDI

    XJTAG understøtter nu FTDI

    aktive-komponenter-og-embedded-sw ›XJTAG, en førende leverandør af test- og programmeringsløsninger, understøtter nu FTDI's JTAG-controllerhardware i version 4.3 af XJTAG-softwaresuiten (in english).
  • Samarbejde skal fremme embedded GUI-økosystem

    Samarbejde skal fremme embedded GUI-økosystem

    aktive-komponenter-og-embedded-sw ›GigaDevice og Qt Group præsenterer vidtrækkende samarbejde, der sigter på at forbedre og optimere de grafiske interfaces (GUI'er) til embedded applikationer (in english).
  • 180 mio. til ny chipteknologi

    180 mio. til ny chipteknologi

    branche-og-teknologi ›Et nyt forskningsprojekt med et samlet budget på knap 24 mio. euro skal demonstrere, hvordan spintronik kan bane vej for en ny generation af europæiske chips. Aarhus Universitet får en central rolle i projektet.