Ny systemchip i Keystone famiie

Texas Instruments er klar med ny SoC og evalueringsboard i den såkaldte Keystone familie, der kombinerer DSP- og ARM-kerner med højhastigheds periferienheder - herunder 10 Gbit/s Ethernet (in english).

With the new 66AK2H14 device, developers designing high-performance compute systems now have access to a 10Gbps Ethernet switch-on-chip. The inclusion of the 10GigE switch, along with the other high-speed, on-chip interfaces, saves overall board space, reduces chip count and ultimately lowers system cost and power. The EVM enables developers to evaluate and benchmark faster and easier.

The 66AK2H14 SoC provides industry-leading computational DSP performance at 307 GMACS/153 GFLOPS and 19600 DMIPS of ARM performance, making it ideal for a wide variety of applications such as video surveillance, radar processing, medical imaging, machine vision and geological exploration.

- Customers today require increased performance to process compute-intensive workloads using less energy in a smaller footprint, says Paul Santeler, vice president and general manager, Hyperscale Business, HP.

- As a partner in HP’s Moonshot ecosystem dedicated to the rapid development of new Moonshot servers, we believe TI’s KeyStone design will provide new capabilities across multiple disciplines to accelerate the pace of telecommunication innovations and geological exploration. 

10Gbps Ethernet DSP + ARM SoC

TI’s newest silicon variant, the 66AK2H14, is the latest addition to its high-performance 66AK2Hx SoC family which integrates multiple ARM Cortex-A15 MPCore processors and TI’s fixed- and floating-point TMS320C66x digital signal processor (DSP) generation cores. The 66AK2H14 offers developers exceptional capacity and performance (up to 9.6 GHz of cumulative DSP processing) at industry-leading size, weight, and power.

In addition, the new SoC features a wide array of unique high-speed interfaces, including PCIe, RapidIO, Hyperlink, 1Gbps and 10Gbps Ethernet, achieving total I/O throughput of up to 154Gbps. These interfaces are all distinct and not multiplexed, allowing designers tremendous flexibility with uncompromising performance in their designs.

TI helps simplify the design process by offering developers highly optimized software for embedded HPC systems along with development and debugging tools for the EVMK2H. The EVMK2H features a single 66AK2H14 SoC, a status LCD, two 1Gbps Ethernet RJ-45 interfaces and on-board emulation. An optional EVM breakout card (available separately) also provides two 10Gbps Ethernet optical interfaces for 20Gbps backplane connectivity and optional wire rate switching in high density systems.

The EVMK2H is bundled with TI’s Multicore Software Development Kit (MCSDK), enabling faster development with production ready foundational software. The MCSDK eases development and reduces time to market by providing highly-optimized bundles of foundational, platform-specific drivers, optimized libraries and demos.