Infineon og Fairchild samarbejder om power-pakninger

Infineon og Fairchild indgår 'kompatibilitets-aftale' indenfor power MOSFETs (in english).

Infineon Technologies and Fairchild Semiconductor has announced a packaging partnership for their power MOSFETs in the Infineon PowerStage 3x3 or Fairchild MLP 3x3 (Power33) packages.

The compatibility agreement is in response to the need for supply security while balancing the drive towards best-in-class efficiency and thermal performance in DC-DC conversion. It takes advantage of the expertise both companies offer for asymmetric, dual and single MOSFETs for DC-DC applications from 3A to 20A.

- "Standardizing power packages benefits our customers as we minimize the amount of ‘unique’ packages available in the market place, while offering solutions that enhance performance levels in smaller form factors than the previous generations, says Richard Kuncic, director and product line manager Low Voltage MOSFETs at Infineon Technologies.

- Fairchild and Infineon have standardized the pin-out and have complementing performance levels, offering customers two sources for their high efficiency design needs in the computing, telecom and server markets, says John Bendel, Fairchild’s senior vice president of Low Voltage Products.
- This package alignment is staged to deliver performance leading products in a multi-source, industry standard package.