Power MOSFETs leder varme via toppen af pakningen

Texas Instruments lancerer ny power MOSFETs med kraftigt reduceret termisk impedans (in english).

Texas Instruments (TI) has introduced the industry’s first family of standard-footprint power MOSFETs that dissipate heat through the top of the package for high-current DC/DC applications.

The so-called DualCool NexFET power MOSFETs reduce end equipment size, while providing up to 50 percent more current through the MOSFET and improving thermal management over other standard-footprint packages. 

This new family of five NexFET devices allows computing and telecom system designers to use higher current processors with expanded memory while saving board space. These MOSFETs in an advanced package can be used in a wide range of end applications including desktop personal computers, servers, telecommunications or networking equipment, basestations, and high current industrial systems. 

- Our customers demand higher current DC/DC power supplies in a smaller footprint to meet the need for increased processing power in the broad infrastructure market.  DualCool NexFET power MOSFETs meet this need by conducting more current in the same form factor, says Steve Anderson, TI’s senior vice president and worldwide manager, Power Management. 

DualCool NexFET devices are available in volume now from TI and its authorized distributors. Suggested resale pricing for the CSD16325Q5C is $1.47 in 1,000-unit quantities. Samples and application notes are available.

Order NexFET evaluation modules and samples: www.ti.com/mosfet-dcpr
DualCool NexFET power MOSFETs video demonstration: www.ti.com/mosfet-vpr