STudbygger samarbejde med GLOBALFOUNDRIES
STMicroelectronics har valgt GLOBALFOUNDRIES 22nm FD-SOI teknologiplatform til firmaets næste generation af processorer til industri- og konsumerapplikationer (in english).GLOBALFOUNDRIES (GS) and STMicroelectronics has announced that ST has selected GF’s 22nm FD-SOI (22FDX) technology platform to support its next-generation of processor solutions for industrial and consumer applications.
After deploying the industry’s first 28nm FD-SOI technology platform, ST is extending its commitment and roadmap by adopting GF’s production-ready 22FDX process and ecosystem to deliver second-generation FD-SOI solutions for the intelligent systems of tomorrow.
- FD-SOI is ideally suited for cost-sensitive applications requiring significant processing and connectivity capabilities at lower power consumption, says Joël Hartmann, Executive Vice President, Digital Front-End Manufacturing and Technology, STMicroelectronics.
- The cost-effective performance and best-in-class energy efficiency benefits of GF’s 22FDX platform, coupled with ST’s extensive design experience and IP base in FD-SOI, will enable our customers with unparalleled value for power, performance and cost. We are relying on GF’s Dresden site for manufacturing products using this technology.
- ST has established a strong track record with FD-SOI technology, adds Alain Mutricy, senior vice president of product management at GF.
- The addition of GF’s 22FDX platform, coupled with ST’s long history of pioneering new technologies and products, will enable the two companies to deliver differentiated FD-SOI products at the 22nm node.
As a complementary path to FinFETs, GF’s versatile FDX platform offers the ability to integrate digital, analog, and RF functions onto a single chip, which allows customers to design intelligent and fully-integrated system solutions. The technology is uniquely suited for chips that require performance on demand and energy efficiency at the lowest solution cost, making it ideal for a broad range of applications, from intelligent clients and wireless connectivity to artificial intelligence and smart vehicles.