Samarbejde om højtintegrerede Wi-FI 6 moduler

Murata har valgt at at benytte RF frond-end IC'er fra NXP i en ny serie af ultrakompakte Wi-Fi 6 moduler (in english).

NXP Semiconductors has announced it has collaborated with Murata, a system-in-package integrator for 5G mobile platforms, to deliver the industry’s first radio frequency (RF) front-end modules designed with the latest Wi-Fi 6 standards. Together, the companies are delivering a solution that can reduce design times, improve time-to-market and save board space in next generation Wi-Fi 6 implementations.

The NXP FEIC is tightly packed in a chip scale package (CSP) suitable for module integration and can support various 5G smartphones and portable computing devices. Additionally, it enables high performance 2x2 multiple input multiple output (MIMO) functionality.

- Murata is very pleased to work with NXP to develop RF front-end modules for Wi-Fi 6 platforms — NXP’s monolithic front-end ICs are fully verified in leading Wi-Fi 6 platforms and offer perfect flexibility in terms of size and integration, says Katsuhiko Fujikawa, R&D Manager of Murata Manufacturing Co., Ltd.
- We plan to continue working with NXP and hope to develop newer modules in forthcoming years that support new spectrums and standards. 

- Working with Murata helps manufacturers deliver a highly integrated, fully tested and qualified solution for 5G devices while providing the highest performance and smallest size to meet rapidly rising global demand for Wi-Fi 6, says Paul Hart, Senior Vice President and General Manager of NXP’s Radio Frequency business.
- No other chipmaker in the industry today can provide a comparable solution to meet demands of rapid deployments. 

NXP enables the next step in Wi-Fi 6 implementations by providing a high performance WLAN11ax portfolio to support customers in fulfilling the ever-increasing need for more bandwidth. By providing both the 2.4 GHz and the 5 GHz bands that fit the 802.11ax Wi-Fi 6 standard, NXP offers a flexible portfolio that scales across these specifications.

27/4 2020