Microchip præsenterer rumkvalificerede FPGA'er

Microchip præsenterer rumkvalificerede FPGA'er

Microchip udvider porteføljen af rumkvalificerede med ny RT FPGA portefølje samt SoC-varianter (in english).

Continuing to support the evolving needs of space system developers, Microchip Technology (Nasdaq: MCHP) has announced two new milestones for its Radiation-Tolerant (RT) PolarFire technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.

These achievements underscore the company’s more than 60 years of spaceflight heritage and its commitment to delivering highly reliable, low-power solutions for the most demanding space applications.

MIL-STD-883 Class B and Qualified Manufacturers List (QML) Class Q are industry standards that define rigorous testing and qualification processes for microelectronic components used in high-reliability applications, such as space and defense.

MIL-STD-883, developed by the U.S. Department of Defense, outlines methods for environmental, mechanical and electrical testing to ensure device reliability under extreme conditions. QML Class Q, managed by the Defense Logistics Agency (DLA), certifies that manufacturers consistently produce components meeting these stringent requirements.

Unlike traditional SRAM-based FPGAs, RT PolarFire devices utilize nonvolatile technology, making them immune to configuration memory upsets caused by radiation. This eliminates the need for external mitigation measures, helping reduce system complexity and overall cost.

RT PolarFire FPGAs consume up to 50% less power than mid-range SRAM-based alternatives, enabling satellite designers to optimize Size, Weight and Power (SWaP) without compromising mission-critical reliability. The PolarFire RTPF500ZT FPGA advances the family’s capabilities, offering enhanced Single Event Latch-up (SEL) radiation performance and increased robustness for inflight programming compared to the original RTPF500T.

- Microchip Technology has a proven track record of supporting critical space missions, spanning low Earth orbit, satellite platforms and deep space exploration. Our commitment to stringent quality standards, compliance with international regulations and long-term product reliability has solidified Microchip’s reputation as a trusted provider of aerospace hardware. As the industry demands higher performance, increased logic density and robust security, we remain dedicated to innovating solutions that address the evolving needs of modern space systems, says Shakeel Peera, vice president of marketing and strategy for Microchip’s FPGA business unit.

Engineering samples of the RT PolarFire SoC FPGA further strengthen Microchip’s portfolio of space-qualified solutions. This SoC integrates a real-time, Linux®-capable, RISC-V-based microprocessor subsystem with a flight-proven FPGA architecture, enabling both flexible software support and deterministic real-time performance. With a roadmap to QML Class V and Class Y, the RT PolarFire SoC FPGA is well suited for central satellite processing, avionics and payload control where high reliability is essential.

RT PolarFire devices are supported by the Libero SoC Design Suite, a comprehensive IP library, reference designs and solution stacks tailored for space applications. RT PolarFire SoC FPGAs also integrate with Microchip’s Mi-V ecosystem for RISC-V development. Additionally, development kits and hardware platforms are available to facilitate rapid prototyping, hardware validation and system integration, enabling engineers to efficiently bring mission-critical space systems from concept to deployment.

Microchip’s latest milestones in radiation-tolerant FPGA technology reflect ongoing progress in addressing the stringent requirements of contemporary space missions. With a focus on continuous improvement and industry collaboration, the company is well positioned to support the next generation of satellite, avionics and deep space systems. Additional information, technical documentation, and development resources can be found on the

17/7 2025
  • Microchip udvider dsPIC33A DSC-familien

    Microchip udvider dsPIC33A DSC-familien

    aktive-komponenter-og-embedded-sw ›Med sigte på brug i AI datacentre, komplekse motorstyringer og intelligente sensorapplikationer præsenterer Microchip ny dsPIC33A DSC familie (in english).
  • Silanna vil låse komponentpriser i to år

    Silanna vil låse komponentpriser i to år

    aktive-komponenter-og-embedded-sw ›Mens mange leverandører af analoge komponenter varsler prisstigninger, så lover Silanna Semiconductor at fastholde priserne på firmaets højtydende ADC'er to år frem i tiden (in english).
  • Power management IC'er optimeret til STM32 microprocessorer

    Power management IC'er optimeret til STM32 microprocessorer

    aktive-komponenter-og-embedded-sw ›STMicroelectronics' nye STPMIC1L og STPMIC2L PMIC'er hjælper designere med at udnytte processorkraften i ST's Arm Cortex-A microprocessorer (MPU'er) i industrielle applikationer.
  • Arm lancerer firmaets første 'egne' chips

    Arm lancerer firmaets første 'egne' chips

    aktive-komponenter-og-embedded-sw ›Arm tilbyder nu for første gang i firmaets historie også fysiske siliciumprodukter, der fra starten er understøttet af et stort globalt dækkende økosystem (in english).
  • Referencedesign demonstrerer potentialet ved single-pair Ethernet

    Referencedesign demonstrerer potentialet ved single-pair Ethernet

    aktive-komponenter-og-embedded-sw ›I samarbejde med Bourns, Microchip og Amphenol Technology har Arrow Electronics udviklet single pair Ethernet reference/evalurerings-platform (in english).
  • DesignSuite forbedrer workflows fra simulering til BOM-eksport og indkøb

    DesignSuite forbedrer workflows fra simulering til BOM-eksport og indkøb

    aktive-komponenter-og-embedded-sw ›DigiKey har samarbejdet med STMicroelectronics og Ultra Librarian om forbedret DesignSuite workflow og integration, der rækker fra simulering til BOM-eksport og indkøb.
  • Europæisk universitets-konsortium skal samarbejde om den næste generation af chips

    Europæisk universitets-konsortium skal samarbejde om den næste generation af chips

    aktive-komponenter-og-embedded-sw ›Med imec som et centralt omdrejningspunkt er 26 europæiske universitets-grupperinger (dog ingen danske) gået sammen om forskning i chipteknologier, der går videre end transistorskalering, som man har kendt i mange årtier (in english).
  • Wireless systemchip med NPU-enhed

    Wireless systemchip med NPU-enhed

    kommunikation-iot-og-cybersikkerhed ›Nordic Semiconductor styrker firmaets nRF54L serie med første produkter, der inkluderer en NPU-enhed og dermed gør det muligt at implementere edge AI i ultra-low power applikationer (in english).