Miniature mikrofon med Bluetooth LE Audio og Auracast support

Miniature mikrofon med Bluetooth LE Audio og Auracast support

Den svenske startup virksomhed Emendion har valgt Insight SIP’s ISP2053-AX til firmaets Bluetooth Low Energy Audio og Auracast miniature-mikrofon (in english).

Bluetooth Low Energy (LE) Audio has been available for several years now, based on the Bluetooth 5.2 release, with the full specifications completed in 2022. 

It takes time, however, for specifications to yield working devices, and in the case of LE Audio, to have true value, you need an ecosystem of compatible 'other ends' - headphones, speakers, smartphone support and so on. This takes time, and so it is only now that use of LE Audio is becoming prevalent in audio solutions.

Auracast is an important new feature that represents a major upgrade to BT Audio capability - allowing broadcast from an transmitting device to several receivers. The previous generation of BT Audio based on 'classic' Bluetooth could only support a point to point connection. 

No complex pairing is required either - one can simply “tune in” to any available Auracast stream without Bluetooth connection, and as a passive listening mode, it poses no security risk.

Applications areas for Auracast include conference halls, guided tours, shared music listening, public TVs, and hearing assistance and many more. The advantage of an open standard is that no custom equipment is required to listen to an Auracast broadcast – any Auracast enabled headphone or hearing aid, for example, can participate.

Startup with new perspective

Emendion is a Swedish audio technology startup founded in 2023 by engineers Nils Ostlund, Darush Namin and Niclas Sidekrans. The company develops audio products focused on sound quality, wireless technology and new use cases enabled by Bluetooth LE Audio and Auracast.

The new Aspen Aura from Emendion is a tiny high quality microphone that supports LE Audio and Auracast. 

Weighing only 5 grams, it can simply clip onto a shirt or T-shirt for easy hands free use, making it ideal for use in lecture theatres, outdoor events or for a tour guide. The Aspen Aura represents a breakthrough in terms of a professional grade Auracast portable device.

The ISP2053-AX module forms the core of the Emendion solution. This powerful dual-core Bluetooth module contains separate application and radio processors, and is capable of managing the Bluetooth connection and transmission as well as handling audio processing aspect of the solution. 

A rich peripheral set allows it to connect to the four MEMS microphones that form part of the Emendion solution. The multi-mic configuration allows advanced audio processing to achieve excellent background noise reduction.

The excellent power consumption characteristics of the Nordic nRF5340 Bluetooth chip incorporated in the module allow 5 hours usage on a single charge. 

The ISP2053 module has an integrated antenna, and thus in one tiny (8 x 8 x 1 mm) component offers audio/Auracast processing and full Bluetooth connectivity including audio streaming and wireless configuration and setup.

In addition to the Aspen Aura, Emendion also offer a USB-C plug in receiver dongle. This device allows older equipment (PCs, Phones etc) that are not natively supporting Auracast and BLE Audio to work with the Aspen Aura solution. This device is also powered by Insight SIP’s IPS2053 module and is a similarly miniature and lightweight device.

Niclas Sidekrans, Co-Founder and Lead Engineer at Emendion explains:

 - We selected the Insight SiP ISP2053 module for its size, performance, and the ease of working with a fully certified, highly integrated solution. It serves as the core processing module in our system, handling microphone input, PDM to PCM conversion, audio processing, and Bluetooth connectivity.

Nick Wood, Sales and Marketing Director at Insight SIP adds:

- We love this tiny, innovative LE audio solution; Auracast offers all kinds of new possibilities for low energy audio, and we are delighted to be chosen to be a part of Emendion’s Aspen Aura solution.

27/5 2026
  • Europæisk industriel Linux til sikre og suveræne embedded systemer

    Europæisk industriel Linux til sikre og suveræne embedded systemer

    aktive-komponenter-og-embedded-sw ›SYSGO præsenterer ELinOS 8, som er den seneste generation af firmaets industrielle Linux platforme, der er designet specielt til missionskritiske embedded systemer (in english).
  • Unik UWB-chip til positions- og tilstedeværelses-detektering

    Unik UWB-chip til positions- og tilstedeværelses-detektering

    kommunikation-iot-og-cybersikkerhed ›Infineon præsenterer AIROC UWB TSL100, der en single-chip løsning til præcis positionerings- og tilstedeværelses- (presence) detektering (in english).
  • SiC-MOSFET relæer til højspændings power- og testapplikationer

    SiC-MOSFET relæer til højspændings power- og testapplikationer

    aktive-komponenter-og-embedded-sw ›OMRON lancerer nye G3VH SiC-MOSFET-relæer med spændings-ratings på 3.300 V og 1.800 V, der tilbyder fordelene ved solid-state powereffektswitching ved bus- og batterispændinger på op til 1.000 V eller mere (in english).
  • Toshiba er klar med samples af nye 'entry-level' MCU'er

    Toshiba er klar med samples af nye 'entry-level' MCU'er

    aktive-komponenter-og-embedded-sw ›Toshiba kan nu levere design-samples af firmaets TXZ+ Family Entry-Class M4H Group af standard microcontrollere.
  • XJTAG understøtter nu FTDI

    XJTAG understøtter nu FTDI

    aktive-komponenter-og-embedded-sw ›XJTAG, en førende leverandør af test- og programmeringsløsninger, understøtter nu FTDI's JTAG-controllerhardware i version 4.3 af XJTAG-softwaresuiten (in english).
  • Samarbejde skal fremme embedded GUI-økosystem

    Samarbejde skal fremme embedded GUI-økosystem

    aktive-komponenter-og-embedded-sw ›GigaDevice og Qt Group præsenterer vidtrækkende samarbejde, der sigter på at forbedre og optimere de grafiske interfaces (GUI'er) til embedded applikationer (in english).
  • 180 mio. til ny chipteknologi

    180 mio. til ny chipteknologi

    branche-og-teknologi ›Et nyt forskningsprojekt med et samlet budget på knap 24 mio. euro skal demonstrere, hvordan spintronik kan bane vej for en ny generation af europæiske chips. Aarhus Universitet får en central rolle i projektet.
  • Digitale isolatorer til low-power produkter

    Digitale isolatorer til low-power produkter

    aktive-komponenter-og-embedded-sw ›Toshiba præsenterer to nye firekanals digitale isolatorer, der understøtter stabil og energieffektiv isoleret signaltransmission til multikanal kommunikationsapplikationer med middelhøj hastighed.