DELTA udvider IBM-samarbejde
DELTA kan nu tilbyde tilgang til en lang række af IBM's ASIC-teknologier og -services (in english).
DELTA Microelectronics, the European provider of value-added ASIC services, has concluded an agreement with IBM, a leading semiconductor foundry, to enable customers of DELTA Microelectronics to access a wide range of DELTA’s solutions and services combined with IBM’s technologies .
As a result of this agreement DELTA will become a Semiconductor Value Added Reseller (SVAR) for IBM in Europe, the Middle East and Africa (EMEA) providing customers with access to IBM foundry technologies and post-wafer production services including turnkey and partial turnkey ASIC solutions.
The portfolio of leading-edge technologies offered by IBM, including bulk CMOS and speciality foundry processes, such as analog, mixed-signal, high-voltage, RF/CMOS, RF/SOI and SiGe/BiCMOS technologies, complemented by DELTA’s services including design, test, package engineering, assembly, characterisation, qualification, failure analysis, logistics and supply chain management can offer fabless IC, IDM and system companies a complete and effective route for their IC products.
- We are very pleased to partner with IBM, a leader and innovator in the foundry business. The leading edge IBM semiconductor technologies, including RF, analogue and deep submicron processes, will enable DELTA to offer a wide range of custom IC solutions. Our flexible GDSII to component production services will provide customers with a versatile path to access a range of solutions based on IBM technologies from prototyping to high volume component production, says Per Ølund, Director of DELTA Microelectronics.
- This collaboration can provide our customers access to a variety of added services, such as design, wafer post-processing, test and packaging. DELTA offers a single point of engagement, leveraging the IBM technologies, to offer a shorter time to market, says drian O’Connor, Director EMEA Semiconductor Sales at IBM Microelectronics.
Chips for mobile phones, wireless connectivity and intelligent sensors are amongst the application areas which will be the target of the collaboration to provide customers in these markets with advanced solutions in semiconductor technology, test and packaging.
