IDT bliver 'fabless'

IDT har indgået en produktionssamarbejdsaftale med TSMC. IDT vil i løbet af en to-årig periode flytte al produktion til TSMC (in english). 

IDT, a leading provider of essential mixed signal semiconductor solutions, and Taiwan Semiconductor Manufacturing Company (TSMC),  have entered into an agreement to transfer product fabrication processes and related activities currently running in the IDT Hillsboro, Oregon facility to TSMC foundries.  The transfer, which has already received approval by both companies and the IDT Board of Directors, is expected to take up to two years to complete and will cover the lifecycle of all products involved. 

- Over the past year or so, IDT has been shifting gears towards developing application specific solutions for the communications, computing and consumer markets.  Obtaining an agreement with TSMC enables us to take full advantage of their cutting edge manufacturing processes and geometries and is the logical next step in our transformation, says Mike Hunter, Vice President of Worldwide Manufacturing for IDT. -
- This agreement, which will combine IDT system expertise and architecture and the TSMC technology platform, expands our overall global manufacturing capability. It also officially starts the countdown for IDT to move from a fab-lite to a fab-less model.

- The fabless model enables IDT to focus our resources and investments on innovative new product development where we can leverage our core strengths in definition and design differentiation, while outsourcing manufacturing to the industry leader, says Ted Tewksbury, President and CEO of IDT.

- This initiative is a key enabler of our mixed signal strategy as IDT’s products transition to more advanced process technologies supporting higher levels of speed, complexity and integration.

IDT product processes and geometries transferred under this agreement include existing IDT products currently manufactured at the Fab 4 facility in Hillsboro, Oregon at .13 micron process technology and above. These processes and products will be transferred to TSMC over the ensuing two years. The agreement does not include transfer or sale of the process equipment or the IDT facility located in Hillsboro, Oregon. 

IDT intends to exit the Hillsboro, Oregon wafer fabrication facility at the end of the transfer period and has engaged a third party to market the facility to potential buyers that can continue fabrication operations.