MIPS i tættere samarbejde med TSMC
MIPS og TSMC vil dele informationer om design, teknologi og roadmap med sigte på at optimere MIPS IP-kerner til TSMC's procesteknologi (in english).
MIPS Technologies has joined the TSMC Soft IP Alliance Program to speed customers' time-to-market. Through the Soft IP Program, TSMC is expected to provide specific design documents and technology information so that MIPS and other Alliance partners can optimize IP cores for TSMC's process technologies. The companies will also collaborate on roadmap alignment to expedite IP readiness.
- "By sharing design, technology and roadmap information with TSMC, we can drive toward closer alignment and speed development for our many customers who work with TSMC on chip fabrication. We look forward to continuing to deepen our relationship with TSMC to further benefit our mutual customers, says Art Swift, vice president of marketing and business development, MIPS Technologies.
- The combination of TSMC's foundry-leading technologies and manufacturing capability with MIPS Technologies' soft IP cores will enable customers to gain early insight into the power, performance and area trade-offs inherent in their SoC designs. This is an increasingly critical factor in meeting time to market objectives. We are pleased to be able to deliver this important information to our customers to help them make the best possible decisions, says Dan Kochpatcharin, deputy director, IP Portfolio Marketing at TSMC.
TSMC's new Soft IP Program enriches TSMC's IP alliance portfolio, encourages soft IP innovation and reuse through TSMC's Open Innovation Platform initiative, and aims to deliver power, performance and area optimization that is important at advanced technology nodes.
