Samarbejde om optisk kommunikation mellem CMOS-chips
Det belgiske forskningscenter imec lancerer nyt industrielt samarbejdsprogram, der sigter på brug af optisk I/O teknologi til kommunikation mellem CMOS-chips (in english).
Imec announces the launch of a new industrial affiliation program on high-bandwidth optical input/output (I/O). The primary objective of the new program, which is part of imecs research platform on deep-submicron CMOS scaling, is to explore the use of optical solutions for realizing high-bandwidth I/O between CMOS chips.
According to the ITRS roadmap, the aggregate data rate for off-chip communication is expected to exceed 100Tb/s by 2020. However, no known manufacturable solution for achieving such bandwidth density is currently available. Silicon photonics has been identified as a prime candidate to deliver a technology solution for enabling cost-effective short-range optical links.
The main benefits of silicon-based optical interconnects are their high speed, compact footprint, low power consumption and low cost, which enable the realization of a scalable interconnect solution. Moreover, the compatibility with existing CMOS processing infrastructure as well as the possibility of co-integration with CMOS circuits are additional important assets of the silicon photonics technology.
During the past ten years, imec and its associated lab INTEC at Ghent University have proven a track record in demonstrating the outstanding performance of silicon-based optical devices for high-speed data transmission, using silicon-on-insulator (SOI) substrates.
Imecs new optical I/O program builds on this extensive expertise and aims at further developing a silicon-photonics solution for addressing the upcoming scaling challenges in interconnecting CMOS chips, in close collaboration with imecs industrial partners.
The program includes a two-fold path-finding effort. First, the complete electrical-to-optical-to-electrical (E-O-E) transmission path will be modeled for various technological implementations and benchmarked against the requirements for various applications, as well as against existing solutions.
This benchmarking effort will focus on optimizing bandwidth density, power consumption, thermal robustness and cost at the system level. Second, demonstrators of the full optical link will be realized in silicon, including all required components such as optical modulators, germanium-based photodetectors, and thermally robust optical multiplexers, as well as their CMOS-based driving and receiving circuits.
The optical I/O IIAP is part of imecs core program in which imec works together with leading IC companies on future CMOS technologies. In this framework, imecs core partners will actively participate in the IIAP at imec in Leuven (Belgium). Such on-site participation enables partner companies to have early access to new technology insights, processes and equipment.
