Fuldt indkapslet digitalt powermodul
Intersil lancerer fuldt indkapslet 12A digital DC/DC powermodul med PMBus Interface (in english).
Intersil Corp. is introducing the ZL9101M, an encapsulated, highly-integrated digital DC/DC power module designed for point-of-load (POL) power management in applications such as servers, telecommunications, networking and storage equipment.
This new digital power module follows Intersil’s 'Power Made Simpleø philosophy by providing customers with a building block that can be easily adapted to varying system power requirements. The ZL9101M is a quick and easy alternative for power solutions up to 12A, and dramatically reduces the number of discrete components and complicated external ICs required to implement a complete POL power management solution. The ZL9101M also delivers the most thermally efficient package, significantly improving system reliability.
For an easy-to-use, out-of-the-box solution, system designers can take advantage of the ZL9101M’s default configuration. For additional design flexibility, the ZL9101M simplifies smart power management designs via the module’s PMBus interface.
The PMBus, which is enabled by an internal Zilker Labs digital controller, provides maximum design flexibility and enables easy real-time monitoring of voltage, current, temperature and other parameters. The ZL9101M also includes adaptive performance optimization algorithms to improve power conversion performance and efficiency across the entire load range.
The ZL9101M significantly reduces customers’ bill of materials by integrating MOSFETs, power inductor and discrete components, along with the Intersil Zilker Labs digital DC/DC controller. For applications requiring greater than 12A output current, multiple ZL9101Ms can be paralleled using Digital-DC current sharing technology.
Designers can quickly configure a complete digital power solution with the PowerNavigator GUI interface. The PowerNavigator interface modifies module parameters with a click of the mouse -- no soldering iron required.
The ZL9101M is packaged in a 15mm x 15mm thermally-enhanced QFN with large thermal pads on the underside and exposed leads around the perimeter for visual solder joint inspection. Very low thermal resistivity of 11.5C/W on the top of the package and 2.2C/W on the underside enables an industry-best power density of 61W/cm3 (over three times the density of competing solutions).
