Nye 15A og 25A step-down regulatorer
TI’s nye 15A, TPS56121, og 25A, TPS56221, DC/DC konvertere inkluderer som de første NexFET MOSFETs (in english).
At the 2011 Applied Power Electronics Conference (APEC), Texas Instruments (TI) introduced the industry’s smallest, most efficient step-down regulators with integrated FETs to support up to 25 A for telecommunications, networking and other applications.The easy-to-use, 25-A, 14-V, TPS56221 synchronous SWIFT switcher with integrated NexFET MOSFETs achieves a power density greater than 200 W/in3 with greater than 90-percent efficiency at high loads from a 12-V input to a 1.3-V output, delivering up to 25 A of continuous output current at 500-kHz switching frequency. The new TPS56121 15-A, 14-V synchronous switcher is three percent more efficient at 5-V input to 1.2-V output and switches twice as fast as similar 15-A products in the market, according to TI.
- Board-mounted power supplies are typically packed with circuitry and require greater power density and power efficiency – especially those systems operating at higher currents, says Sami Kiriaki, senior vice president of TI’s Power Management business.
- These two new products expand our SWIFT family into higher current applications and allow our customers to achieve breakthroughs in power density, efficiency and thermal management – and ultimately more energy-efficient and reliable end equipment.”
The TPS56221 and TPS56121 come in a thermally enhanced 5-mm x 6-mm QFN package, and achieve a total solution size of 315 mm2 - 30-percent smaller than other discrete solutions. Both devices are the first switchers to integrate TI’s NexFET technology, providing increased thermal performance, protection, efficiency and reliability. The switchers offer three selectable frequencies of 300 kHz, 500 kHz and 1 MHz for design flexibility and support input voltages of 4.5 V to 14 V.
In addition to the high-current capabilities of SWIFT converters, TI’s CSD86350Q5D NexFET Power Block, which was introduced last year, enables highly efficient, multi-phase point-of-load designs with higher current capability. The small, 5-mm x 6-mm stacked MOSFET, in a grounded, lead-frame SON package, supports frequencies up to 1.5 MHz, reduces thermal impedance and simplifies layout.
The CSD86350Q5D can achieve greater than 90-percent efficiency at 25 A, and can be combined with TI’s TPS40140 stackable controller to support multi-phase designs, scalable to 50 A, 100 A and higher – while maintaining high efficiency across the load.
The TPS56221 and TPS56121 come in an easy-to-solder, 22-pin, 5-mm x 6-mm QFN package with a single PowerPad thermal pad. Samples and evaluation modules are expected at the end of March.
www.ti.com/tps56221-preu.
