ST lancerer ny power-pakning
STMicroelectronics lancerer den såkaldte SMBflat pakning til bl.a. AC switche, SCRs og Triacs, der er 40 procent tyndere og optager det halve PCB-areal i forhold til SOT-223 (in english).
STMicroelectronics (ST) has introduced a new package that will allow the further miniaturization of control modules that must meet strict safety specifications such as IEC 60370 and IEC 60335.
ST is initially using its new three-lead surface-mount package, SMBflat, to house selected products including an AC switch, an SCR (silicon-controlled rectifier) and three types of Triac, which are widely used in circuits such as valve, motor or pump controls, lamp igniters and circuit breakers.
Occupying half the printed-circuit-board (PCB) area of the popular SOT-223, the new package allows ST’s new ACS108 1-Amp AC switch to achieve the highest ever current density - a key figure of merit - for this type of device.
The SMBflat package is also 40% skinnier than the SOT-223, which increases freedom for designers to miniaturize enclosures. Additionally, the ‘creepage’ distances of ST’s X02 series SCRs and Z01 series Triacs, which use this new package, will help meet the insulation requirements of the major safety standards for domestic and industrial electrical equipment (IEC 60370 and IEC 60335).
A specific footprint can be designed on the PCB, where either SOT-223 or SMBflat packages can be soldered. This solution guarantees full compatibility of both packages and provides flexibility at the production stage.
The SMBflat package is a feature of the ACS108-6SUF-TR AC switch, X0202NUF silicon controlled rectifier (SCR), and the Z0103/07/09MUF series of Triacs. All devices are available immediately in sample quantities.
